JAJSMF3A May   2022  – September 2022 TPS25985

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Logic Interface
    7. 7.7 Timing Requirements
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Undervoltage Protection
      2. 8.3.2  Insertion Delay
      3. 8.3.3  Overvoltage Protection
      4. 8.3.4  Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 8.3.4.1 Slew rate (dVdt) and Inrush Current Control
          1. 8.3.4.1.1 Start-Up Time Out
        2. 8.3.4.2 Steady-State Overcurrent Protection (Circuit-Breaker)
        3. 8.3.4.3 Active Current Limiting During Start-Up
        4. 8.3.4.4 Short-Circuit Protection
      5. 8.3.5  Analog Load Current Monitor (IMON)
      6. 8.3.6  Mode Selection (MODE)
      7. 8.3.7  Parallel Device Synchronization (SWEN)
      8. 8.3.8  Stacking Multiple eFuses for Unlimited Scalability
        1. 8.3.8.1 Current Balancing During Start-Up
      9. 8.3.9  Analog Junction Temperature Monitor (TEMP)
      10. 8.3.10 Overtemperature Protection
      11. 8.3.11 Fault Response and Indication (FLT)
      12. 8.3.12 Power Good Indication (PG)
      13. 8.3.13 Output Discharge
      14. 8.3.14 General Purpose Comparator
      15. 8.3.15 FET Health Monitoring
      16. 8.3.16 Single Point Failure Mitigation
        1. 8.3.16.1 IMON Pin Single Point Failure
        2. 8.3.16.2 ILIM Pin Single Point Failure
        3. 8.3.16.3 IREF Pin Single Point Failure
        4. 8.3.16.4 ITIMER Pin Single Point Failure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Single Device, Standalone Operation
      2. 9.1.2 Multiple Devices, Parallel Connection
    2. 9.2 Typical Application: 12-V, 3.6-kW Power Path Protection in Datacenter Servers
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Performance Plots
    3. 9.3 Multiple eFuses, Parallel Connection with PMBus
    4. 9.4 Digital Telemetry Using External Microcontroller
    5. 9.5 What to Do and What Not to Do
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
    2. 10.2 Output Short-Circuit Measurements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.3.9 Analog Junction Temperature Monitor (TEMP)

The device allows the system to monitor the junction temperature (TJ) accurately by providing an analog voltage on the TEMP pin which is proportional to the temperature of the die. This voltage can be connected to the ADC input of a host controller or eFuse with digital telemetry. In a multi-device parallel configuration, the TEMP outputs of all devices can be tied together. In this configuration, the TEMP signal reports the temperature of the hottest device in the chain.

Note:
  1. The TEMP pin voltage is used only for external monitoring and does not interfere with the overtemperature protection scheme of each individual device which is based purely on the internal temperature monitor.
  2. TI recommends to add a capacitance of 22 pF on the TEMP pin to filter out glitches during system transients.
  3. The current source on the TEMP pin of TPS25985x is internally clamped to a safe value to protect against overload, short circuit on this pin. This can lead to incorrect temperature reporting on the TEMP when the number of devices connected in parallel is higher than 6. This limitation can be overcome by connecting an external pull-resistance on the TEMP pin.