JAJSEM6J April   2006  – October 2020 TXB0104

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: VCCA = 1.2 V
    7. 6.7  Timing Requirements: VCCA = 1.5 V ± 0.1 V
    8. 6.8  Timing Requirements: VCCA = 1.8 V ± 0.15 V
    9. 6.9  Timing Requirements: VCCA = 2.5 V ± 0.2 V
    10. 6.10 Timing Requirements: VCCA = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics: VCCA = 1.2 V
    12. 6.12 Switching Characteristics: VCCA = 1.5 V ± 0.1 V
    13. 6.13 Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    14. 6.14 Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    15. 6.15 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    16. 6.16 Operating Characteristics: VCCA = 1.2 V to 1.5 V, VCCB = 1.5 V to 1.8 V
    17. 6.17 Operating Characteristics: VCCA = 1.8 V to 3.3 V, VCCB = 1.8 V to 5 V
    18. 6.18 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Input Driver Requirements
      3. 8.3.3 Output Load Considerations
      4. 8.3.4 Enable and Disable
      5. 8.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 サポート・リソース
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • D|14
  • RGY|14
  • RUT|12
  • NMN|12
  • YZT|12
  • PW|14
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TXB0104 UNIT
D GXU/ZXU PW RGY RUT YZT NMN
14 PINS 12 PINS 14 PINS 14 PINS 12 PINS 12 PINS 12 PINS
RθJA Junction-to-ambient thermal resistance 90.7 127.1 121.0 52.8 119.8 89.2 134.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.5 92.8 50.0 67.7 42.6 0.9 90.7
RθJB Junction-to-board thermal resistance 45.4 62.2 62.8 28.9 52.5 14.4 88.4
ψJT Junction-to-top characterization parameter 14.7 2.3 6.4 2.6 0.7 3.0 4.3
ψJB Junction-to-board characterization parameter 45.1 62.2 62.2 29.0 52.3 14.4 89.3
RθJC(bot) Junction-to-case (bottom) thermal resistance ─ ─ ─ ─ ─ ─ ─
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.