JAJSSA9A November   2023  – December 2024 DAC61401 , DAC81401

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements - Write, IOVDD = 1.7V to 2.7V
    7. 5.7  Timing Requirements - Write, IOVDD = 2.7V to 5.5V
    8. 5.8  Timing Requirements - Read and Daisy Chain, FSDO = 0, IOVDD = 1.7V to 2.7V
    9. 5.9  Timing Requirements - Read and Daisy Chain, FSDO = 1, IOVDD = 1.7V to 2.7V
    10. 5.10 Timing Requirements - Read and Daisy Chain, FSDO = 0, IOVDD = 2.7V to 5.5V
    11. 5.11 Timing Requirements - Read and Daisy Chain, FSDO = 1, IOVDD = 2.7V to 5.5V
    12. 5.12 Timing Diagrams
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Digital-to-Analog Converter (DAC) Architecture
      2. 6.3.2 R-2R Ladder DAC
      3. 6.3.3 Programmable Gain Output Buffer
      4. 6.3.4 Sense Pins
      5. 6.3.5 DAC Register Structure
        1. 6.3.5.1 Output Update
        2. 6.3.5.2 Software Clear
          1. 6.3.5.2.1 Software Reset Mode
      6. 6.3.6 Internal Reference
      7. 6.3.7 Power-Supply Sequence
        1. 6.3.7.1 Power-On Reset (POR)
      8. 6.3.8 Thermal Alarm
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power Down Mode
    5. 6.5 Programming
      1. 6.5.1 Stand-Alone Operation
      2. 6.5.2 Daisy-Chain Operation
      3. 6.5.3 Frame Error Checking
  8. 7 Register Map
    1. 7.1 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Key Components
        2. 8.2.2.2 Compensation Capacitor
        3. 8.2.2.3 Gain Stage
        4. 8.2.2.4 Attenuation and Buffer Stage
        5. 8.2.2.5 External Power Supply
        6. 8.2.2.6 Protection Design
        7. 8.2.2.7 Design Accuracy
      3. 8.2.3 Application Curves
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) DACx1401 UNIT
PW (TSSOP) RTE (WQFN)
20 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 83.1 56.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 21.7 30.2 °C/W
RθJB Junction-to-board thermal resistance 36.0 19.0 °C/W
ΨJT Junction-to-top characterization parameter 0.9 0.3 °C/W
ΨJB Junction-to-board characterization parameter 35.4 18.9 °C/W
(1) For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.