SLYW038D September   2014  – April 2025 AFE030 , AFE031 , AFE032 , ALM2402-Q1 , LMC6035-Q1 , LMV601 , LMV602 , LMV604 , LMV611 , LMV612 , LMV614 , LMV881 , OPA1602 , OPA1604 , OPA1612 , OPA1612-Q1 , OPA1622 , OPA1652 , OPA1654 , OPA1662 , OPA1662-Q1 , OPA1664 , OPA1688 , OPA170 , OPA170-EP , OPA171-Q1 , OPA172 , OPA180 , OPA188 , OPA191 , OPA192 , OPA197 , OPA211-EP , OPA2170 , OPA2171 , OPA2171-EP , OPA2171-Q1 , OPA2172 , OPA2180 , OPA2188 , OPA2192 , OPA2211-EP , OPA2211-HT , OPA2227-EP , OPA2277-EP , OPA2313 , OPA2314 , OPA2314-EP , OPA2314-Q1 , OPA2316 , OPA2317 , OPA2320-Q1 , OPA2322-Q1 , OPA2376-Q1 , OPA2625 , OPA313 , OPA314 , OPA316 , OPA317 , OPA320 , OPA322 , OPA348-Q1 , OPA355-Q1 , OPA4170 , OPA4171 , OPA4171-Q1 , OPA4172 , OPA4180 , OPA4188 , OPA4192 , OPA4277-EP , OPA4313 , OPA4314 , OPA4316 , OPA4317 , OPA4322 , OPA4322-Q1 , OPA549-HIREL , OPA564-Q1 , OPA625 , SM73307 , SM73308 , TLC2274-HT , TLE2141-Q1 , TLV2314 , TLV2316 , TLV2333 , TLV27L2-Q1 , TLV314 , TLV316 , TLV333 , TLV4314 , TLV4316 , TLV4333

 

  1.   1
  2.   Analog Engineer's Pocket Reference
  3.   Conversions
    1.     Standard decimal prefixes
    2.     Metric conversions
    3.     Temperature scale conversions
    4.     Error conversions ppm and percentage
    5.     Notes
  4.   Discrete Components
    1.     Resistor color code
    2.     Capacitor specifications
    3.     Capacitance type overview
    4.     Diodes and LEDs
    5.     Bipolar junction transistors (BJT)
    6.     Junction field effect transistors (JFET)
    7.     Metal oxide semiconductor field effect transistor (MOSFET)
    8.     Notes
  5.   Analog
    1.     Resistor equations
    2.     Power equations
    3.     Capacitor equations
    4.     Inductor equations
    5.     RMS and mean voltage
    6.     Logarithmic mathematical definitions
      1.      Alternative notations
    7.     dB definitions
      1.      Bode plot basics
      2.      Definitions
      3.      Log scale
      4.      Time to phase shift
      5.      Bode plots: Poles
    8.     Pole (equations)
      1.      Bode plots (zeros)
      2.      Zero (equations)
    9.     Notes
  6.   Amplifier
    1.     Basic op amp configurations
      1.      Simple non-inverting amp with Cf filter
      2.      Simple inverting amp with Cf filter
      3.      Differential filter cutoff
      4.      Calculating amplifier offset voltage
    2.     Op amp bandwidth
      1.      Small signal step response
    3.     Full power bandwidth
    4.     Large signal response (slew rate)
    5.     Settling Time
    6.     Combining noise sources
      1.      Averaging noise sources
      2.      Noise bandwidth calculation
        1.       Broadband total noise calculation
      3.      1/f total noise calculation
      4.      Thermal noise calculation
      5.      Op amp noise model
      6.      Total noise calculations
    7.     AC response versus frequency (dominant 2-pole system)
      1.      Phase margin versus AC peaking
      2.      Transient overshoot (dominant 2-pole system)
      3.      Phase margin versus percentage overshoot
    8.     Stability open loop SPICE analysis
      1.      Stability transient square wave lab test
      2.      Stability AC sine wave lab test
    9.     Power dissipation calculation
    10.     Electrical overstress (EOS) protection
    11.     Notes
  7.   PCB and Wire
    1.     PCB and Wire
    2.     PCB trace resistance for 1 oz-Cu
    3.     PCB trace resistance for 2 oz-Cu
    4.     Common package type and dimensions
    5.     PCB parallel plate capacitance
    6.     PCB microstrip capacitance and inductance
    7.     PCB adjacent copper traces
    8.     PCB via capacitance and inductance
    9.     Coaxial cable equations
    10.     Notes
  8.   Sensor
    1.     Thermistor
    2.     Resistive temperature detector (RTD)
      1.      RTD equation temperature to resistance (T≥0°C and T<0°C)
      2.      RTD equation resistance to temperature (T≥0°C or RRTD ≥ R0)
      3.      RTD equation resistance to temperature (T< 0°C or RRTD < R0)
    3.     Diode equation vs. temperature
      1.      Diode voltage versus temperature
    4.     Thermocouple (J and K)
      1.      Type J thermocouples translating temperature to voltage (ITS-90 standard)
      2.      Type J thermocouples translating voltage to temperature (ITS-90 standard)
      3.      Type K thermocouples translating temperature to voltage (ITS-90 standard)
      4.      Type K thermocouples translating voltage to temperature (ITS-90 standard)
      5.      Thermistor: Resistance to temperature, Steinhart-Hart equation
      6.      Thermistor: Temperature to resistance, Steinhart-Hart equation
    5.     Notes
  9.   Digital
    1.     Binary/hex conversions
      1.      Numbering systems: Binary, decimal, and hexadecimal
        1.       Example conversion: Binary to decimal
        2.       Example conversion: Decimal to binary
        3.       Example conversion: Binary to hexadecimal
        4.       Example conversion: Hexadecimal to decimal and decimal to hexadecimal
      2.      Data formats
        1.       Converting two’s complement to decimal: Negative number example
        2.       Converting two’s complement to decimal: Positive number example
    2.     Digital logic thresholds
    3.     Serial peripheral interface
      1.      SPI bus (Serial Peripheral Interface) hardware overview
        1.       Data and control lines
      2.      SPI data latching
        1.       SPI read sequence example
      3.      SPI critical edge
      4.      SPI modes
    4.     Inter-integrated circuit (I2C) bus
      1.      I2C bus (Inter-Integrated Circuit) hardware overview
        1.       Data and control lines
      2.      I2C addressing
      3.      I2C communication
      4.      I2C interface circuitry and rise/fall timing
      5.      I2C pull-up resistor selection
    5.     Notes
  10.   ADC
    1.     ADC transfer function
      1.      ADC definitions
      2.      ADC resolution for unipolar
        1.       Full-scale range (FSR) unipolar
      3.      ADC resolution for bipolar
        1.       Full-scale range (FSR) bipolar
      4.      Resolution voltage vs. full-scale range
    2.     Quantization error of ADC
      1.      Quantization error
    3.     Signal-to-noise ratio (SNR) from quantization noise only
    4.     Total harmonic distortion (VRMS)
    5.     Total harmonic distortion (dBc)
    6.     AC signals
      1.      Signal-to-noise and distortion (SINAD) and effective number of bits (ENOB)
    7.     DC signals
      1.      Noise free resolution and effective resolution
    8.     Settling time and conversion accuracy
    9.     ADC system noise calculation
    10.     Effect of clock jitter on ADC SNR
    11.     Notes
  11.   DAC
    1.     DAC errors
      1.      DAC definitions
      2.      DAC offset error
      3.      DAC gain error
      4.      DAC zero-code error / negative full-scale error
      5.      DAC bipolar zero error
      6.      DAC full-scale error
    2.     DAC non-linearity
      1.      DAC differential non-linearity
      2.      DAC integral non-linearity
    3.     DAC total unadjusted error
    4.     Notes
  12.   Multiplexer
    1.     CMOS switch construction
    2.     ON-resistance (RON)
    3.     RON flatness
    4.     Effective op amp gain including MUX RON
      1.      Design tips
    5.     ON and OFF capacitance (CON/ COFF)
    6.     Leakage current
      1.      Off leakage current
      2.      On leakage current
    7.     Charge injection (QINJ)
    8.     Bandwidth (BW)
    9.     Channel-to-channel crosstalk (XTALK)
    10.     OFF-isolation
    11.     Total harmonic distortion plus noise (THD+N)
    12.     Notes
  13.   TI Worldwide Technical Support

PCB and Wire

Table 19 Printed circuit board conductor spacing
Voltage between conductors (DC or AC peaks) Minimum spacing
Bare board Assembly
B1 B2 B3 B4 A5 A6 A7
0-15 0.05 mm [0.00197 in] 0.1 mm [0.0039 in] 0.1 mm [0.0039 in] 0.05 mm [0.00197 in] 0.13 mm [0.00512 in] 0.13 mm [0.00512 in] 0.13 mm [0.00512 in]
16-30 0.05 mm [0.00197 in] 0.1 mm [0.0039 in] 0.1 mm [0.0039 in] 0.05 mm [0.00197 in] 0.13 mm [0.00512 in] 0.25 mm [0.00984 in] 0.13 mm [0.00512 in]
31-50 0.1 mm [0.0039 in] 0.6 mm [0.024 in] 0.6 mm [0.024 in] 0.13 mm [0.00512 in] 0.13 mm [0.00512 in] 0.4 mm [0.016 in] 0.13 mm [0.00512 in]
51-100 0.1 mm [0.0039 in] 0.6 mm [0.024 in] 1.5 mm [0.0591 in] 0.13 mm [0.00512 in] 0.13 mm [0.00512 in] 0.5 mm [0.020 in] 0.13 mm [0.00512 in]
101-150 0.2 mm [0.0079 in] 0.6 mm [0.024 in] 3.2 mm [0.126 in] 0.4 mm [0.016 in] 0.4 mm [0.016 in] 0.8 mm [0.031 in] 0.4 mm [0.016 in]
151-170 0.2 mm [0.0079 in] 1.25 mm [0.0492 in] 3.2 mm [0.126 in] 0.4 mm [0.016 in] 0.4 mm [0.016 in] 0.8 mm [0.031 in] 0.4 mm [0.016 in]
171-250 0.2 mm [0.0079 in] 1.25 mm [0.0492 in] 6.4 mm [0.252 in] 0.4 mm [0.016 in] 0.4 mm [0.016 in] 0.8 mm [0.031 in] 0.4 mm [0.016 in]
251-300 0.2 mm [0.0079 in] 1.25 mm [0.0492 in] 12.5 mm [0.492 in] 0.4 mm [0.016 in] 0.4 mm [0.016 in] 0.8 mm [0.031 in] 0.8 mm [0.031 in]
301-500 0.25 mm [0.00984 in] 2.5 mm [0.0984 in] 12.5 mm [0.492 in] 0.8 mm [0.031 in] 0.8 mm [0.031 in] 1.5 mm [0.0591 in] 0.8 mm [0.031 in]

Where

B1 = internal conductors

B2 = external conductors uncoated sea level to 3050m

B3 = external conductors uncoated above 3050m

B4 = external conductors coated with permanent polymer coating (any elevation)

A5 = external conductors with conformal coating over assembly (any elevation)

A6 = external component lead/termination, uncoated, sea level to 3050m

A7 = external component lead termination, with conformal coating (any elevation)

Extracted with permission from IPC-2221B, Table 6

For additional information, the entire specification can be downloaded at http://www.ipc.org

Self heating of PCB traces on inside layer Figure 59 Self heating of PCB traces on inside layer

Example

Find the current that will cause a 20°C temperature rise in a PCB trace that is 0.1 inch wide and uses 2 oz/ft2 copper. (Assume traces are on inner layer of PCB.)

Answer

First translate 0.1 inch to 250 sq. mils. using bottom chart. Next, find the current associated with 20°C and 250 sq. mils. using top chart (Answer = 5A).

Extracted with permission from IPC-2152, Figure 5.

For additional information the entire specification can be downloaded at www.ipc.org.

PCB trace resistance Figure 60 PCB trace resistance

Trace resistance

Equation 158. R = ρ L t · W 1 + α T − 25 ∘ C

Where

ρ = resistivity of trace (for copper = 17∙10-6 Ω∙mm)

α = temperature coefficient (for copper = 3.9∙10-3 /°C)

L, W = length and width of trace in mm or mil. Note: L and W must both be in the same units.

t = thickness of trace in mm (1 oz copper = 0.0348mm, 2 oz copper = 0.0696mm)

T = temperature in °C

Example

What is the resistance of a 20 mil long, 5 mil wide trace for a 1 oz Cu thickness at 25°C and 125°C?

Answer

Equation 159. R 25 C = 1.95 m Ω , R 125 C = 2.72 m Ω R = 17 · 10 − 6 Ω · mm 20 mil ( 0.0348 mm ) · 5 mil 1 + 3.9 · 10 − 3 / ∘ C 125 ∘ C − 25 ∘ C = 2.72 m Ω