SPRUJC0 April   2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specifications
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Hardware Description
      1. 2.1.1 Functional Description and Connections
        1. 2.1.1.1  Power Domains
        2. 2.1.1.2  LEDs
        3. 2.1.1.3  Encoder Connectors
        4. 2.1.1.4  FSI
        5. 2.1.1.5  PGA
        6. 2.1.1.6  CAN
        7. 2.1.1.7  CLB
        8. 2.1.1.8  Boot Modes
        9. 2.1.1.9  BoosterPack Sites
        10. 2.1.1.10 Analog Voltage Reference Header
        11. 2.1.1.11 Other Headers and Jumpers
          1. 2.1.1.11.1 USB Isolation Block
          2. 2.1.1.11.2 BoosterPack Site 2 Power Isolation
          3. 2.1.1.11.3 Alternate Power
      2. 2.1.2 Debug Interface
        1. 2.1.2.1 XDS110 Debug Probe
        2. 2.1.2.2 XDS110 Output
        3. 2.1.2.3 Virtual COM Port
      3. 2.1.3 Alternate Routing
        1. 2.1.3.1 Overview
        2. 2.1.3.2 UART Routing
        3. 2.1.3.3 EQEP Routing
        4. 2.1.3.4 CAN Routing
        5. 2.1.3.5 PGA Routing
        6. 2.1.3.6 FSI Routing
        7. 2.1.3.7 X1/X2 Routing
        8. 2.1.3.8 PWM DAC
    2. 2.2 Using the F28P55x LaunchPad
    3. 2.3 BoosterPacks
    4. 2.4 Hardware Revisions
      1. 2.4.1 Revision A
  9. 3Software
    1. 3.1 Software Development
      1. 3.1.1 Software Tools and Packages
      2. 3.1.2 F28P55x LaunchPad Demo Program
      3. 3.1.3 Programming and Running Other Software on the F28P55x LaunchPad
  10. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
      1. 4.2.1 LAUNCHXL-F28P55X Board Dimensions
    3. 4.3 Bill of Materials (BOM)
  11. 5Additional Information
    1. 5.1 Frequently Asked Questions
    2. 5.2 Trademarks
  12. 6References
    1. 6.1 Reference Documents
    2. 6.2 Other TI Components Used in This Design

2.3 BoosterPacks

The LAUNCHXL-F28P55X provides a simple and inexpensive way to develop applications with the F28P55x series microcontroller. BoosterPacks are pluggable add-on boards for the LaunchPad ecosystem that follow a pin-out standard created by Texas Instruments. The TI and third-party ecosystem of BoosterPacks greatly expands the peripherals and potential applications that you can explore with the F28P55x LaunchPad.

Some examples of BoosterPacks that are compatible with the F28P55x LaunchPad are listed in Table 3-7. Please note that this is not an exhaustive list of hardware supported BoosterPacks.

Table 2-7 Featured BoosterPacks for the F28P55x LaunchPad
BoosterPack/BoardApplication and Usage
BOOSTXL-3PHGANINVFeatures a 48V/10A three-phase GaN inverter with precision in-line shunt-based phase current sensing for accurate control of precision drives such as servo drives.
BOOSTXL-DRV8323RS
BOOSTXL-DRV8323RH		DRV8323RS/H three-phase, 15A smart gate driver with buck, shunt amps (SPI or hardware interface) evaluation module.
TMDSFSIADAPEVMFSI adapter board assists in understanding the functionality of the FSI communications peripheral of the C2000. Enables evaluation of the peripheral for decentralized and point-to-point real-time control system use cases, such as those in industrial drives, servo, sensing networks, and solar system and industrial power.
DRV8353RS-EVM15A, 3-phase brushless DC drive stage based on the DRV8353RS gate driver and CSD19532Q5B NexFET™ MOSFETs.
DRV8316REVMDRV8316REVM provides three half-H-bridge integrated MOSFET drivers for driving a three-phase brushless DC (BLDC) motor with 8A Peak current drive, for 12V/24V DC rails or battery powered applications.
BOOSTXL-BUCKCONVDigital Power Buck Converter BoosterPack for learning the basics of digital power control with C2000 microcontrollers. The buck converter power stage supports dynamic loads and converts an external 9-VDC power supply to a configurable DC output voltage.
BOOSTXL-POSMGRPosition Manager BoosterPack is a flexible low voltage platform intended for evaluating interfaces to absolute encoders and analog sensors like resolvers and SinCos transducers.
BOOSTXL-SHARP128Sharp® 128x128 Memory LCD and microSD Card BoosterPack, controlled using SPI. Display sensor readings, time, graphics, or other information using the LCD screen.
Note: Software support for the BoosterPacks and boards listed vary.

Users can also design BoosterPacks for the F28P55x LaunchPad. Make sure that compatibility requirements are met by referencing the signal pin mapping in the LAUNCHXL-F28P55X Pinout Map or LAUNCHXL-F28P55X Schematic.