DLPS249 December   2024 DLP991U

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Switching Characteristics
    8. 5.8  Timing Requirements
    9. 5.9  System Mounting Interface Loads
    10. 5.10 Micromirror Array Physical Characteristics
    11. 5.11 Micromirror Array Optical Characteristics
    12. 5.12 Window Characteristics
    13. 5.13 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 DMD Temperature Calculation
      1. 6.6.1 Off-State Thermal Differential (TDELTA_MIN)
      2. 6.6.2 On-State Thermal Differential (TDELTA_MAX)
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
    3. 7.3 DMD Die Temperature Sensing
    4. 7.4 Power Supply Recommendations
      1. 7.4.1 DMD Power Supply Power-Up Procedure
      2. 7.4.2 DMD Power Supply Power-Down Procedure
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
        1. 7.5.1.1 PCB Design Standards
        2. 7.5.1.2 General PCB Routing
          1. 7.5.1.2.1 Trace Impedance and Routing Priority
          2. 7.5.1.2.2 Example PCB Layer Stack-Up
          3. 7.5.1.2.3 Trace Width, Spacing
          4. 7.5.1.2.4 Power and Ground Planes
          5. 7.5.1.2.5 Trace Length Matching
            1. 7.5.1.2.5.1 HSSI Input Bus Skew
            2. 7.5.1.2.5.2 Other Timing Critical Signals
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
      2. 8.1.2 Device Markings
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
      1. 10.1.1 Packaging Information
7.5.1.2.1 Trace Impedance and Routing Priority
For best performance, TI recommends a target impedance for the PCB of 50Ω ±10% for single-ended signals. The differential signals that are 100Ω ±10% are described in Trace Impedance.
Table 7-5 Trace Impedance
SIGNALS DIFFERENTIAL IMPEDANCE
HSSI DMD Interface—DMD_D_(A,B,C,D)[7:0], DMD_DCLK_(A,B,C,D) 100Ω differential
DMD LS Interface—DMD_LS_CLK, DMD_LS_WDATA 100Ω differential

Table 7-6 lists the routing priority of the signals.

Table 7-6 Routing Priority
SIGNALS PRIORITY
HSSI DMD Interface - DMD_D_(A,B,C,D)[7:0], DMD_DCLK_(A,B,C,D) 1
DMD LS Interface - DMD_LS_CLK, DMD_LS_WDATA 2
All other signals

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