DLPS249 December   2024 DLP991U

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Switching Characteristics
    8. 5.8  Timing Requirements
    9. 5.9  System Mounting Interface Loads
    10. 5.10 Micromirror Array Physical Characteristics
    11. 5.11 Micromirror Array Optical Characteristics
    12. 5.12 Window Characteristics
    13. 5.13 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 DMD Temperature Calculation
      1. 6.6.1 Off-State Thermal Differential (TDELTA_MIN)
      2. 6.6.2 On-State Thermal Differential (TDELTA_MAX)
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
    3. 7.3 DMD Die Temperature Sensing
    4. 7.4 Power Supply Recommendations
      1. 7.4.1 DMD Power Supply Power-Up Procedure
      2. 7.4.2 DMD Power Supply Power-Down Procedure
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
        1. 7.5.1.1 PCB Design Standards
        2. 7.5.1.2 General PCB Routing
          1. 7.5.1.2.1 Trace Impedance and Routing Priority
          2. 7.5.1.2.2 Example PCB Layer Stack-Up
          3. 7.5.1.2.3 Trace Width, Spacing
          4. 7.5.1.2.4 Power and Ground Planes
          5. 7.5.1.2.5 Trace Length Matching
            1. 7.5.1.2.5.1 HSSI Input Bus Skew
            2. 7.5.1.2.5.2 Other Timing Critical Signals
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
      2. 8.1.2 Device Markings
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
      1. 10.1.1 Packaging Information

5.11 Micromirror Array Optical Characteristics

SYMBOLPARAMETERTEST CONDITIONSMINTYPMAXUNIT
Micromirror tilt angle(2)(3)(4)(5)landed state(1)1113Degrees
COTMicromirror crossover time(6)typical performance1

3

μs
Micromirror switching time(7)typical performance

4

μs
Orientation of the micromirror axis-of-rotation(8) 44 46 Degrees
Micromirror array optical efficiency(9)(10) 400nm to 420nm, with all micromirrors in the ON state 66%
Micromirror array optical efficiency(9)(10) 410nm to 800nm, with all micromirrors in the ON state 63%
Non-operating micromirrors(11) Non-adjacent micromirrors 10 micromirrors
Adjacent micromirrors 0
(1) Measured relative to the plane formed by the overall micromirror array. 
(2) Additional variation exists between the micromirror array and the package datums. 
(3) Represents the landed tilt angle variation relative to the nominal landed tilt angle. 
(4) Represents the variation that can occur between any two individual micromirrors, located on the same device or located on different devices. 
(5) For some applications, it is critical to account for the micromirror tilt angle variation in the overall system optical design. With some system optical designs, the micromirror tilt angle variation within a device may result in perceivable non-uniformities in the light field reflected from the micromirror array. With some system optical designs, the micromirror tilt angle variation between devices may result in colorimetry variations, system efficiency variations or system contrast variations. 
(6) The time required for a micromirror to nominally transition from one landed state to the opposite landed state. 
(7) The minimum time between successive transitions of a micromirror at the end of a Mirror Clocking Pulse to the beginning of the next Mirror Clocking Pulse.
(8) Measured relative to the package datums 'B' and 'C'.
(9) The minimum or maximum DMD optical efficiency observed in a specific application depends on numerous application-specific design variables, such as:
  • Illumination wavelength, bandwidth/line-width, degree of coherence
  • Illumination Angle, plus angle tolerance
  • Illumination and projection aperture size, and location in the system optical path
  • Illumination overfill of the DMD micromirror array
  • Aberrations present in the illumination source and/or illumination path
  • Aberrations present in the projection path

The specified nominal DMD optical efficiency is based on the following use conditions:

  • Visible illumination (400 to 800 nm)
  • Input illumination optical axis oriented at 24° relative to the window normal
  • Projection optical axis oriented at 0° relative to the window normal
  • ƒ / 3 illumination aperture
  • ƒ / 2.4 projection aperture

Based on these use conditions, the nominal DMD optical efficiency results from the following four components:

  • Micromirror array fill factor: nominally 90%
  • Micromirror array diffraction efficiency: nominally 86%
  • Micromirror surface reflectivity: nominally 88%
  • Window transmission: nominally 97% (single pass, through two surface transitions)
(10) Does not account for the effect of micromirror switching duty cycle, which is application dependent. Micromirror switching duty cycle represents the percentage of time that the micromirror is actually reflecting light from the optical illumination path to the optical projection path. This duty cycle depends on the illumination aperture size, the projection aperture size, and the micromirror array update rate.
(11) Non-operating micromirror is defined as a micromirror that is unable to transition nominally from the "OFF" position to the "ON" position or vice versa.