SBASAO4B December   2024  – June 2025 ADC3568 , ADC3569

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - Power Consumption
    6. 6.6  Electrical Characteristics - DC Specifications
    7. 6.7  Electrical Characteristics - AC Specifications (ADC3568 - 250 MSPS)
    8. 6.8  Electrical Characteristics - AC Specifications (ADC3569 - 500 MSPS)
    9. 6.9  Timing Requirements
    10. 6.10 Typical Characteristics, ADC3568
    11. 6.11 Typical Characteristics, ADC3569
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
        1. 8.3.1.1 Nyquist Zone Selection
        2. 8.3.1.2 Analog Front End Design
      2. 8.3.2 Sampling Clock
      3. 8.3.3 Multi-Chip Synchronization
        1. 8.3.3.1 SYSREF Monitor
      4. 8.3.4 Time-Stamp
      5. 8.3.5 Overrange
      6. 8.3.6 External Voltage Reference
      7. 8.3.7 Digital Gain
      8. 8.3.8 Decimation Filter
        1. 8.3.8.1 Uncommon Decimation Ratios
        2. 8.3.8.2 Decimation Filter Response
        3. 8.3.8.3 Decimation Filter Configuration
        4. 8.3.8.4 Numerically Controlled Oscillator (NCO)
      9. 8.3.9 Digital Interface
        1. 8.3.9.1 Parallel LVDS (SDR) - Default
        2. 8.3.9.2 Parallel LVDS (DDR)
        3. 8.3.9.3 SLVDS with Decimation
          1. 8.3.9.3.1 SLVDS - Status Bit Insertion
        4. 8.3.9.4 Output Data Format
        5. 8.3.9.5 32-bit Output Resolution
        6. 8.3.9.6 Output Scrambler
        7. 8.3.9.7 Output MUX
        8. 8.3.9.8 Test Pattern
    4. 8.4 Device Functional Modes
      1. 8.4.1 Low Latency Mode
      2. 8.4.2 Power Down Mode
    5. 8.5 Programming
      1. 8.5.1 GPIO Programming
      2. 8.5.2 Register Write
      3. 8.5.3 Register Read
      4. 8.5.4 Device Programming
      5. 8.5.5 Register Map
      6. 8.5.6 Detailed Register Description
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Wideband Spectrum Analyzer
      2. 9.2.2 Design Requirements
        1. 9.2.2.1 Input Signal Path
        2. 9.2.2.2 Clocking
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 Sampling Clock
      4. 9.2.4 Application Performance Plots
      5. 9.2.5 Initialization Set Up
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Output Data Format

The output data can be configured to two's complement (default) or offset binary formatting using SPI register writes (register 0x162). Table 8-12 provides an overview for minimum and maximum output codes for the two formatting options and 16 or 32-bit output resolution.

Table 8-12 Overview of minimum and maximum output codes vs resolution for different formatting
Two's Complement (default)Offset Binary
RESOLUTION (BIT)16321632
VIN,MAX0x7FFF0x7FFF FFFF0xFFFF0xFFFF FFFF
00x00000x0000 00000x80000x8000 0000
VIN,MIN0x80000x8000 00000x00000x0000 0000