SBAU478 February   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specifications
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Power Supplies
    2. 2.2 EVM Analog Input
    3. 2.3 ADC Circuit
    4. 2.4 Jumper Information
  9. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layer Plots
    3. 3.3 Bill of Materials (BOM)
  10. 4Additional Information
    1. 4.1 Trademarks
  11. 5Related Documentation

3.3 Bill of Materials (BOM)

Designator Quantity Value Description Package Reference Part Number Manufacturer
!PCB1 1 Printed Circuit Board DC-369 Any
@H1, @H2 2 Machine Screw Pan PHILLIPS M3 RM3X4MM 2701 APM HEXSEAL
C1, C2, C3, C4, C22 5 0.1uF CAP, CERM, 0.1 uF, 25 V, +/- 5%, X7R, 0603 0603 C0603C104J3RACTU Kemet
C5, C6, C7, C8, C12, C13, C15, C16 8 470pF CAP, CERM, 470 pF, 50 V, +/- 5%, C0G/NP0, 0402 0402 GRM1555C1H471JA01D MuRata
C17, C18 2 22uF CAP, CERM, 22 µF, 16 V,+/- 20%, X5R, 0603 0603 CL10A226MO7JZNC Samsung
C19, C20, C21 3 1uF CAP, CERM, 1 µF, 10 V,+/- 10%, X7R, 0603 0603 LMK107B7105KA-T Taiyo Yuden
C24 1 10uF CAP, CERM, 10 µF, V,+/- 10%, X7R, 0805 0805 GRM21BR71A106KA73L

MuRata
FID1, FID2, FID3 3 Fiducial mark. There is nothing to buy or mount. N/A N/A

N/A
H1, H2 2 ROUND STANDOFF M3 STEEL 5MM ROUND STANDOFF M3 STEEL 5MM 9774050360R Wurth Elektronik
H3, H4, H5, H6 4 Bumpon, Hemisphere, 0.44 X 0.20, Clear Transparent Bumpon SJ-5303 (CLEAR)

3M
J1, J2 2 Header, 100mil, 5x2, Gold, TH 5x2 Header TSW-105-07-G-D

Samtec
J3 1 39357 Series 3.5mm Pitch Straight PCB Trm Blk w/ Solder Term, Through Hole, 3 Way CONN_TB-3 393570003

Molex
J4, JP1, JP2 3 Header, 100mil, 3x1, Gold, TH 3x1 Header TSW-103-07-G-S

Samtec
J5 1 Header, 100mil, 10x2, Gold, TH 10x2 Header TSW-110-07-G-D Samtec
J6 1 Header(Shrouded), 19.7mil, 30x2, Gold, SMT Header (Shrouded), 19.7mil, 30x2, SMT QTH-030-01-L-D-A Samtec
JP3 1 Header, 100mil, 2x1, Gold, TH 2x1 Header TSW-102-07-G-S Samtec
LBL1 1 Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll PCB Label 0.650 x 0.200 inch THT-14-423-10 Brady
R1, R2, R3, R4, R7, R8, R9, R10, R19, R32, R34 11 0 RES, 0, 5%, 0.1 W, 0603 0603 RC0603JR-070RL Yageo
R5, R6 2 365 RES, 365, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW0402365RFKED Vishay-Dale
R11, R12, R13, R14, R15, R16, R17, R18

8

 60.4 RES, 60.4, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW040260R4FKED Vishay-Dale
R20, R21, R22, R23, R24, R25, R26 7 49.9 49.9 Ohms ±0.1% 0.063W, 1/16W Chip Resistor 0402 (1005 Metric) Thin Film 0402 RT0402BRD0749R9L Yageo
R27, R28 2 4.7k Res Thick Film 1.0 x 0.5 mm 4.7K Ohm 5% 0.063W(1/16W) 100ppm/ C Molded SMD Paper T/R 0402 RC0402JR-074K7L YAGEO
R29 1 1.00k RES, 1.00 k, 0.1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 ERA-2APB102X Panasonic
R30 1 10.0k RES, 10.0 k, 1%, 0.1 W, 0603 0603 RC0603FR-0710KL

Yageo
R31 1 130 RES, 130, 0.5%, 0.1 W, 0603 0603 RT0603DRE07130RL

Yageo America
R33 1 3.00k RES, 3.00 k, 0.1%, 0.1 W, 0603 0603 RG1608P-302-B-T5

Susumu Co Ltd
SH-J1, SH-J2 2 Single Operation 2.54mm Pitch Open Top Jumper Socket Single Operation 2.54mm Pitch Open Top Jumper Socket M7582-05 Harwin
TP1 1 Test Point, Multipurpose, Black, TH Black Multipurpose Testpoint 5011 Keystone Electronics
TP2, TP3 2 Test Point, Multipurpose, Red, TH Red Multipurpose Testpoint 5010 Keystone Electronics
U1, U2 2 11-MHz, Precision, Low-Noise, RRO, JFET Op Amp in Space‑Enhanced Plastic

TSSOP14

 OPA4H014PWSEP Texas Instruments
U3 1 ADC168M102RRHBTSEP VQFN32 ADC168M102RRHBTSEP Texas Instruments
U4 1 LDO Regulator Pos 1.21V to 20V 1A 6-Pin(5+Tab) SOT-223 Tube SOT223-6 TPS73801MDCQPSEP Texas Instruments
U5 1 I2C BUS EEPROM (2-Wire), TSSOP-B8 TSSOP-8 BR24G32FVT-3AGE2 Rohm
C9, C10, C11, C14 0 4700pF CAP, CERM, 4700 pF, 100 V, +/- 5%, C0G/NP0, 0603 0603 C0603C472J1GAC7867 Kemet
C23 0 10uF CAP, CERM, 10 µF, V,+/- 10%, X7R, 0805 0805 GRM21BR71A106KA73L MuRata