SBOA578A January   2025  – September 2026 TMCS1123 , TMCS1123-Q1 , TMCS1126 , TMCS1127 , TMCS1127-Q1 , TMCS1133 , TMCS1133-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Initial Examination of TMCS EVM With Corresponding Copper Lugs
    1. 2.1 Individual EVMs
    2. 2.2 Initial Examination of 3oz and 4oz Copper Single Panels
      1. 2.2.1 TMCS1123EVM 3oz and 4oz Single Panel
      2. 2.2.2 TMCS1143EVM 3oz and 4oz Single Panel
  6. 3Experimental Setup and Discussion
  7. 4Case 1: Copper Weight
    1. 4.1 TMCS1123EVM Varying Copper Weight
    2. 4.2 TMCS1143EVM Varying Copper Weight
  8. 5Case 2: Polygon Sizing
    1. 5.1 TMCS1123EVM Varying Polygon Sizing
    2. 5.2 TMCS1143EVM Varying Polygon Sizing
  9. 6Summary
  10. 7References
  11. 8Revision History
Application Note

PCB Thermal Analysis of In-Package Magnetic Current Sensors