SBOA578A January   2025  – September 2026 TMCS1123 , TMCS1123-Q1 , TMCS1126 , TMCS1127 , TMCS1127-Q1 , TMCS1133 , TMCS1133-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Initial Examination of TMCS EVM With Corresponding Copper Lugs
    1. 2.1 Individual EVMs
    2. 2.2 Initial Examination of 3oz and 4oz Copper Single Panels
      1. 2.2.1 TMCS1123EVM 3oz and 4oz Single Panel
      2. 2.2.2 TMCS1143EVM 3oz and 4oz Single Panel
  6. 3Experimental Setup and Discussion
  7. 4Case 1: Copper Weight
    1. 4.1 TMCS1123EVM Varying Copper Weight
    2. 4.2 TMCS1143EVM Varying Copper Weight
  8. 5Case 2: Polygon Sizing
    1. 5.1 TMCS1123EVM Varying Polygon Sizing
    2. 5.2 TMCS1143EVM Varying Polygon Sizing
  9. 6Summary
  10. 7References
  11. 8Revision History

5 Case 2: Polygon Sizing

The second case analyzed is a reduction in the polygon size for the same current sweep. From the above, the 4oz copper weight profile serves as the starting point for this experiment, as this is the full 100% of plane topology. For the TMCS1123EVM each polygon leading into the inputs is approximately 900mm2 in terms of PCB area, equating to 1800mm2 of two 2-layer, 4oz via-stitched planes. From this base calculation, ratios of 40%, 60%, and 80% of this area were calculated, and removed from the PCB while keeping the designed for shape of the PCB polygon pours. The same procedure was done for each EVM family tested as they do not all start with the same size input polygon area.