SBOA578 January   2025 TMCS1123 , TMCS1123-Q1 , TMCS1126 , TMCS1127 , TMCS1127-Q1 , TMCS1133 , TMCS1133-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Initial Examination of TMCS11xxEVM with CB70-14-CY Copper Lugs
  6. 3Experimental Setup and Discussion
  7. 4Case 1: Copper Weight
  8. 5Case 2: Polygon Sizing
  9. 6Summary
  10. 7References

6 Summary

This application note shows a method for assessing thermal performance of in-package magnetic current sensors. Current carrying capability is shown to be enhanced, as expected, by copper weight placed on a PCB. However, polygon sizing was shown to play a much a smaller role in thermal mitigation. Overall, the curves presented in this document can help designers to make informed decisions about the total amount of copper needed for an in-package current sensor for proper steady state operation.