SBOA620 March   2025 TMCS1126 , TMCS1126-Q1 , TMCS1133 , TMCS1133-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2How Noise Couples Into a System
    1. 2.1 Conducted Emissions and Radiated Emissions
    2. 2.2 Differential Mode Versus Common-Mode Noise
  6. 3Conducted Emissions Design Techniques
    1. 3.1 Design of the TMCS112x and TMCS112x3x EMI Topology
      1. 3.1.1 Components for Differential-Mode Noise Reduction
      2. 3.1.2 Components for Common-Mode Noise Reduction
    2. 3.2 Layout Considerations for EMI Resilience
  7. 4Summary
  8. 5References

Abstract

As electrification continues to drive demand further into high voltage and high power applications, power density is becoming more important, with form factors shrinking for classic designs. With these size reductions, electromagnetic interference (EMI) is becoming a greater challenge in applications to correctly design for and mitigate when tradeoffs do not allow designed for layout conditions. This application note briefly discusses both conducted and radiated emissions and how the emissions relate to the susceptibility of TMCS112x and TMCS113x devices. A brief overview of common-mode and differential-mode noise are discussed, and schematic and layout techniques are provided for the device for the purposes of noise mitigation in the system.