SBOSAN2A August 2025 – December 2025 PGA854
PRODUCTION DATA
| PIN | TYPE | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| A0 | 4 | Input | Gain setting pin 0 |
| A1 | 5 | Input | Gain setting pin 1 |
| A2 | 1 | Input | Gain setting pin 2 |
| DGND | 16 | Power | Ground reference for digital logic and gain setting pins |
| FDA_IN– | 9 | Input | Connection to output driver summing node |
| FDA_IN+ | 12 | Input | Connection to output driver summing node |
| IN– | 3 | Input | Negative (inverting) input |
| IN+ | 2 | Input | Positive (noninverting) input |
| LVDD | 7 | Power | Output driver positive supply. Connect this pin to the positive supply of the ADC to protect from overdriving. |
| LVSS | 14 | Power | Output driver negative supply. Connect this pin to the negative supply of the ADC to protect from overdriving. |
| NC | 8 | — | Do not connect |
| OUT– | 11 | Output | Output (inverting) |
| OUT+ | 10 | Output | Output (noninverting) |
| VOCM | 13 | Input | output common mode control pin |
| VS+ | 6 | Power | Input stage positive supply |
| VS– | 15 | Power | Input stage negative supply |
| Thermal Pad | Thermal pad | — | Solder the thermal pad to the printed-circuit board (PCB). Connect the thermal pad to a plane or large copper pour that is either floating or electrically connected to VS–. Make this connection even for applications that have low power dissipation. |