SCDS219D November   2005  – July 2025 TS5A3157

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 (YZP Only )Switching Characteristics
    8. 5.8 Analog Channel Specifications
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

9.1.1 Device Nomenclature

Table 9-1 Parameter Description
SYMBOLDESCRIPTION
VCOMVoltage at COM
VNCVoltage at NC
VNOVoltage at NO
ronResistance between COM and NC or COM and NO ports when the channel is ON
ΔronDifference of ron between channels in a specific device
ron(flat)Difference between the maximum and minimum value of ron in a channel over the specified range of conditions
INC(OFF)Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the OFF state
INO(OFF)Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the OFF state
INC(ON)Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the ON state and the output (COM) open
INO(ON)Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the ON state and the output (COM) open
ICOM(ON)Leakage current measured at the COM port, with the corresponding channel (COM to NO or COM to NC) in the ON state and the output (NC or NO) open
VIHMinimum input voltage for logic high for the control input (IN)
VILMaximum input voltage for logic low for the control input (IN)
VIVoltage at the control input (IN)
IIH, IILLeakage current measured at the control input (IN)
tONTurn-on time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog output (COM, NC, or NO) signal when the switch is turning ON.
tOFFTurn-off time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog output (COM, NC, or NO) signal when the switch is turning OFF.
tBBMBreak-before-make time. This parameter is measured under the specified range of conditions and by the propagation delay between the output of two adjacent analog channels (NC and NO) when the control signal changes state.
QCCharge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC, NO, or COM) output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the control input. Charge injection, QC = CL  × ΔVCOM, CL is the load capacitance and ΔVCOM is the change in analog output voltage.
CNC(OFF)Capacitance at the NC port when the corresponding channel (NC to COM) is OFF
CNO(OFF)Capacitance at the NO port when the corresponding channel (NO to COM) is OFF
CNC(ON)Capacitance at the NC port when the corresponding channel (NC to COM) is ON
CNO(ON)Capacitance at the NO port when the corresponding channel (NO to COM) is ON
CCOM(ON)Capacitance at the COM port when the corresponding channel (COM to NC or COM to NO) is ON
CICapacitance of control input (IN)
OISOOFF isolation of the switch is a measurement of OFF-state switch impedance. This is measured in dB in a specific frequency, with the corresponding channel (NC to COM or NO to COM) in the OFF state.
XTALKCrosstalk is a measurement of unwanted signal coupling from an ON channel to an OFF channel (NC to NO or NO to NC). This is measured in a specific frequency and in dB.
BWBandwidth of the switch. This is the frequency where the gain of an ON channel is –3 dB below the DC gain.
THDTotal harmonic distortion describes the signal distortion caused by the analog switch. This is defined as the ratio of root mean square (RMS) value of the second, third, and higher harmonic to the absolute magnitude of fundamental harmonic.
I+Static power-supply current with the control (IN) pin at V+ or GND