SCDS219D November   2005  – July 2025 TS5A3157

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 (YZP Only )Switching Characteristics
    8. 5.8 Analog Channel Specifications
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

TS5A3157 DBV and DCK Packages,6-Pin SOT-23 and SC-70(Top View)Figure 4-1 DBV and DCK Packages,6-Pin SOT-23 and SC-70(Top View)
TS5A3157 YZP Package,6-Pin DSBGA(Bottom View)Figure 4-2 YZP Package,6-Pin DSBGA(Bottom View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
1 NO I/O Normally open switch port
2 GND — Ground
3 NC I/O Normally closed switch port
4 COM I/O Common switch port
5 V+ — Power supply
6 IN I Switch select. High = COM connected to NO; Low = COM connected to NC.
(1) I = input, O = output