SDAA059 September   2025 TMCS1123 , TMCS1123-Q1 , TMCS1126 , TMCS1126-Q1 , TMCS1127 , TMCS1127-Q1 , TMCS1133 , TMCS1133-Q1 , TMCS1143 , TMCS1148

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Exposure of the SOIC-10 to Board Level Reliability Testing
    1. 2.1 Examination of Solder Joints Through X-ray
    2. 2.2 Thermal Testing
    3. 2.3 Cross Sections
  6. 3Summary
  7. 4References

Abstract

Texas Instruments uses a unique SOIC-10 package for the TMCS11xx family of devices where a traditional SOIC-16 style package sees eight individual leads fused into two leads. This fused lead frame is used to carry current into the package rather than two sets of four individual leads. However, there is often a need for multi-sourcing in an application, and while the parts are pin to pin compatible, some differences do arise in the make-up. This application note examines the Texas Instruments SOIC-10 package when used on an SOIC-16 land pattern to demonstrate that the SOIC-10 package can be used on the standard SOIC-16 footprints on a printed circuit board without cause for concern.