SGLS154F November   2000  – September 2025 TLV3701-Q1 , TLV3702-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1.     Pin Configuration: TLV3701
    2.     Pin Configurations: TLV3702
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Dissipation Rating Table
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics
    5. 6.5 Switching Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inputs
        1. 7.4.1.1 Operating Common-Mode Ranges
        2. 7.4.1.2 Fail-Safe Inputs
        3. 7.4.1.3 Unused Inputs
      2. 7.4.2 Internal Hysteresis
      3. 7.4.3 Outputs
        1. 7.4.3.1 Push-Pull Output
      4. 7.4.4 ESD Protection
        1. 7.4.4.1 Inputs
        2. 7.4.4.2 Outputs
      5. 7.4.5 Power-On Reset (POR)
      6. 7.4.6 Reverse Battery Protection
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Electrostatic Discharge Caution
    4. 8.4 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

8.3 Electrostatic Discharge Caution

TLV3701-Q1 TLV3702-Q1 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.