SLASFJ7 July   2024 MSPM0C1106-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      10
    3. 6.3 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
      12.      23
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 High Frequency Crystal/Clock
      4. 7.9.4 Low Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Electrical Characteristics
      2. 7.14.2 Voltage Characteristics
    15. 7.15 Comparator (COMP)
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 I2C
      1. 7.16.1 I2C Characteristics
      2. 7.16.2 I2C Filter
      3. 7.16.3 I2C Timing Diagram
    17. 7.17 SPI
      1. 7.17.1 SPI
      2. 7.17.2 SPI Timing Diagram
    18. 7.18 UART
    19. 7.19 TIMx
    20. 7.20 Emulation and Debug
      1. 7.20.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA_B
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 Low-Frequency Sub System (LFSS)
    16. 8.16 VREF
    17. 8.17 COMP
    18. 8.18 Security
    19. 8.19 CRC
    20. 8.20 UART
    21. 8.21 I2C
    22. 8.22 SPI
    23. 8.23 IWDT
    24. 8.24 WWDT
    25. 8.25 RTC_B
    26. 8.26 Timers (TIMx)
    27. 8.27 Device Analog Connections
    28. 8.28 Input/Output Diagrams
    29. 8.29 Serial Wire Debug Interface
    30. 8.30 Device Factory Constants
    31. 8.31 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

8.3.1 Functionality by Operating Mode

Supported functionality in each operating mode is given in Supported Functionality by Operating Mode.

Functional key:

  • EN: The function is enabled in the specified mode.
  • DIS: The function is disabled (either clock or power gated) in the specified mode, but the function's configuration is retained.
  • OPT: The function is optional in the specified mode, and remains enabled if configured to be enabled.
  • NS: The function is not automatically disabled in the specified mode but is not supported.
  • OFF: The function is fully powered off in the specified mode, and no configuration information is retained. When waking up from an OFF state, all module registers must be re-configured to the desired settings by application software.
Table 8-1 Supported Functionality by Operating Mode
Operating Mode RUN SLEEP STOP STANDBY SHUTDOWN
RUN0 RUN1 RUN2 SLEEP0 SLEEP1 SLEEP2 STOP0 STOP2 STANDBY0 STANDBY1
Oscillators SYSOSC EN EN DIS EN EN DIS OPT(1) DIS DIS DIS OFF
LFOSC EN OFF
Clocks CPUCLK 32M 32k 32k DIS OFF
MCLK to PD1 32M 32k 32k 32M 32k 32k DIS OFF
ULPCLK to PD0 32M 32k 32k 32M 32k 32k 4M(1) 32k DIS OFF
ULPCLK to TIMG14/8 32M 32k 32k 32M 32k 32k 4M(1) 32k OFF
RTCCLK 32k OFF
MFCLK OPT DIS OPT DIS OPT DIS OFF
LFCLK 32k DIS OFF
LFCLK to TIMG14/8 32k OFF
MCLK Monitor OPT DIS OFF
LFCLK Monitor OPT OFF
PMU POR Monitor EN OFF
BOR Monitor EN OFF
Core Regulator FULL DRIVE REDUCED DRIVE LOW DRIVE OFF
Core Functions CPU EN DIS OFF
DMA OPT NS (triggers supported) OFF
Flash EN OPT DIS OFF
SRAM EN OPT DIS OFF
PD1 Peripherals SPI0 OPT DIS OFF
CRC OPT DIS OFF
PD0 Peripherals TIMG14/8 OPT OFF
TIMG1/2 OPT DIS OFF
TIMA0 OPT DIS OFF
UART0/1/2 OPT DIS OFF
I2C0/1 OPT DIS OFF
GPIOA/B OPT OPT2 OFF
WWDT0 OPT OPT(2) OFF
IWDT OPT OFF
RTC_B OPT OFF
Analog ADC0 OPT NS (triggers supported) OFF
COMP OPT OFF
VREF OPT NS OFF
Temperature Sensor OPT OFF OFF
IOMUX and IO Wakeup EN DIS w/ WAKE
Wake Sources N/A ANY IRQ PD0 IRQ IOMUX, NRST, SWD
(1) If STOP0 is entered from RUN1 (SYSOSC enabled but MCLK sourced from LFCLK), SYSOSC remains enabled as it was in RUN1, and ULPCLK remains at 32kHz as it was in RUN1. If STOP0 is entered from RUN2 (SYSOSC was disabled and MCLK was sourced from LFCLK), SYSOSC remains disabled as it was in RUN2, and ULPCLK remains at 32kHz as it was in RUN2.
(2) When using the STANDBY1 policy for STANDBY, only TIMG14 and TIMG8 is clocked. Other PD0 peripherals can generate an asynchronous fast clock request upon external activity but are not actively clocked.