SLASFJ7 July   2024 MSPM0C1106-Q1

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Functional Block Diagram
  6. Device Comparison
  7. Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      10
    3. 6.3 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
      12.      23
    4. 6.4 Connections for Unused Pins
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 High Frequency Crystal/Clock
      4. 7.9.4 Low Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Electrical Characteristics
      2. 7.14.2 Voltage Characteristics
    15. 7.15 Comparator (COMP)
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 I2C
      1. 7.16.1 I2C Characteristics
      2. 7.16.2 I2C Filter
      3. 7.16.3 I2C Timing Diagram
    17. 7.17 SPI
      1. 7.17.1 SPI
      2. 7.17.2 SPI Timing Diagram
    18. 7.18 UART
    19. 7.19 TIMx
    20. 7.20 Emulation and Debug
      1. 7.20.1 SWD Timing
  9. Detailed Description
    1. 8.1  Overview
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA_B
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 Low-Frequency Sub System (LFSS)
    16. 8.16 VREF
    17. 8.17 COMP
    18. 8.18 Security
    19. 8.19 CRC
    20. 8.20 UART
    21. 8.21 I2C
    22. 8.22 SPI
    23. 8.23 IWDT
    24. 8.24 WWDT
    25. 8.25 RTC_B
    26. 8.26 Timers (TIMx)
    27. 8.27 Device Analog Connections
    28. 8.28 Input/Output Diagrams
    29. 8.29 Serial Wire Debug Interface
    30. 8.30 Device Factory Constants
    31. 8.31 Identification
  10. Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Pin Attributes

The following table describes the functions available on every pin for each device package.

Note: Each digital I/O on a device is mapped to a specific Pin Control Management Register (PINCMx) that lets users configure the desired Pin Function using the PINCM.PF control bits.

Each digital I/O on a device is mapped to a specific Pin Control Management Register (PINCMx) which allows users to configure the desired Pin Function using the PINCM.PF control bits. The IOMUX only supports connecting one IOMUX-managed digital function to the pin at the same time. The PINCM.PF and PINCM.PC in IOMUX are recommended to be set to 0 when non-IOMUX managed functions (such as analog connections) are intended to be used on a pin. However, non-IOMUX managed signals (such as analog inputs and WAKE inputs) can be enabled on a pin at the same time that an IOMUX managed digital function is enabled on the pin, provided there is no contention between the functions. In this case, the designer must verify that no contention exists between the functions enabled on each pin.

Table 6-1 Digital IO Features by IO Type
BUFFER TYPE INVERSION CONTROL DRIVE STRENGTH CONTROL HYSTERESIS CONTROL PULLUP RESISTOR PULLDOWN RESISTOR WAKEUP LOGIC
SDIO (standard drive) Y Y Y
SDIO (standard drive) with wake1 Y Y Y Y
ODIO (5V-tolerant open drain) Y Y Y Y
  1. Standard with Wake allows the I/O to wake up the device from the lowest low-power mode of SHUTDOWN. All I/O can be configured to wakeup the MCU from higher low-power modes. See section GPIO FastWake in the MSPM0 C-Series Microcontrollers Technical Reference Manual for details.