SLLSFO4D December   2022  – August 2025 ISOM8710 , ISOM8711

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—DC 
    10. 6.10 Switching Characteristics, ISOM8710
    11. 6.11 Switching Characteristics, ISOM8711
    12. 6.12 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Sizing RIN
        2. 9.2.2.2 Driving the Input with a Buffer
        3. 9.2.2.3 Calculating RL for ISOM8711
      3. 9.2.3 Application Curves
      4. 9.2.4 Insulation Lifetime
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.4.1 Layout Guidelines

  • Bypass the VCC pin to ground with a low-ESR ceramic bypass capacitor. The typical recommended bypass capacitance is 0.1μF when using a ceramic capacitor with an X5R- or X7R-rated dielectric. The capacitor must be placed as close to the VCC pin as possible in the PCB layout and on the same layer. The capacitor must have a voltage rating greater than the VCC voltage level.

  • The device connections to ground must be tied to the PCB ground plane using a direct connection or two vias to help minimize inductance.
  • The connections of capacitors and other components to the PCB ground plane must use a direct connection or two vias for minimum inductance.