SLOS887G September   2014  – May 2025 TMP112-Q1 , TMP112D-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Specifications for User-Calibrated Systems (TMP112-Q1 Only)
    7. 6.7  Timing Requirements
    8. 6.8  Timing Diagrams
    9. 6.9  Typical Characteristics (TMP112-Q1)
    10. 6.10 Typical Application (TMP112D-Q1)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
        1. 7.3.2.1 Bus Overview
        2. 7.3.2.2 Serial Bus Address
        3. 7.3.2.3 Writing and Reading Operation
        4. 7.3.2.4 Target Mode Operation
          1. 7.3.2.4.1 Target Receiver Mode
          2. 7.3.2.4.2 Target Transmitter Mode
        5. 7.3.2.5 SMBus Alert Function
        6. 7.3.2.6 General Call
        7. 7.3.2.7 High-Speed (Hs) Mode
        8. 7.3.2.8 Timeout Function
        9. 7.3.2.9 Timing Diagrams
          1. 7.3.2.9.1 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Extended Mode (EM)
      3. 7.4.3 Shutdown Mode (SD)
      4. 7.4.4 One-Shot and Conversion Ready Mode (OS)
      5. 7.4.5 Thermostat Mode (TM)
        1. 7.4.5.1 Comparator Mode (TM = 0)
        2. 7.4.5.2 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1/F0)
        5. 7.5.3.5 Converter Resolution (R1 and R0)
        6. 7.5.3.6 One-Shot (OS)
        7. 7.5.3.7 Extended Mode (EM)
        8. 7.5.3.8 Alert (AL)
        9. 7.5.3.9 Conversion Rate (CR)
      4. 7.5.4 High- and Low-Limit Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Calibrating for Improved Accuracy (TMP112-Q1 Only)
        1. 8.1.1.1 Example 1: Finding Worst-Case Accuracy From –15°C to 50°C
        2. 8.1.1.2 Example 2: Finding Worst-Case Accuracy From 25°C to 100°C
      2. 8.1.2 Using The Slope Specifications With a 1-Point Calibration (TMP112-Q1 Only)
        1. 8.1.2.1 Power Supply-Level Contribution to Accuracy
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision F (June 2022) to Revision G (May 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added TMP112D-Q1 device Specs and graphs throughout the documentGo
  • Added “Device Comparison” table, “Device Orderable Options” table, and “Device Nomenclature” imageGo
  • Added “Active conversion Supply current” and “Standby current” from the context to the Electrical Characteristics table for TMP112-Q1Go
  • Added “Fast Mode Plus” to I2C Timing Requirements tableGo
  • Updated the Output Transfer Function Diagrams graph with Comparator Mode and Interrupt Mode graphs for more clarityGo
  • Updated the Temperature Step Response graph with the new TMP112-Q1/TMP112D-Q1 Temperature Step Response graph for better comparison between DPW and DRL package.Go
  • Added the Support Resources, Electrostatic Discharge Caution, and Glossary sectionsGo
  • Deleted the Community Resources sectionGo

Changes from Revision E (December 2018) to Revision F (June 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed all instances of legacy terminology to controller and target where I2C is mentioned.Go
  • Added the Functional Safety information to the Features sectionGo

Changes from Revision D (December 2015) to Revision E (December 2018)

  • Updated description for ADD0 pin for connection to SDA and SCLGo

Changes from Revision C (March 2015) to Revision D (December 2015)

  • Added NIST Features bullet Go
  • Added last paragraph to Description section Go

Changes from Revision B (November 2014) to Revision C (March 2015)

  • Updated pin numbers on the schematic images Go
  • Changed the Temperature Error at 25°C graph in the Typical Characteristics sectionGo
  • Changed the Temperature Error vs. Temperature graph in the Typical Characteristics section Go

Changes from Revision A (October 2014) to Revision B (November 2014)

  • Changed device status from Product Preview to Production Data Go