SLOS887G September   2014  – May 2025 TMP112-Q1 , TMP112D-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Specifications for User-Calibrated Systems (TMP112-Q1 Only)
    7. 6.7  Timing Requirements
    8. 6.8  Timing Diagrams
    9. 6.9  Typical Characteristics (TMP112-Q1)
    10. 6.10 Typical Application (TMP112D-Q1)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
        1. 7.3.2.1 Bus Overview
        2. 7.3.2.2 Serial Bus Address
        3. 7.3.2.3 Writing and Reading Operation
        4. 7.3.2.4 Target Mode Operation
          1. 7.3.2.4.1 Target Receiver Mode
          2. 7.3.2.4.2 Target Transmitter Mode
        5. 7.3.2.5 SMBus Alert Function
        6. 7.3.2.6 General Call
        7. 7.3.2.7 High-Speed (Hs) Mode
        8. 7.3.2.8 Timeout Function
        9. 7.3.2.9 Timing Diagrams
          1. 7.3.2.9.1 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Extended Mode (EM)
      3. 7.4.3 Shutdown Mode (SD)
      4. 7.4.4 One-Shot and Conversion Ready Mode (OS)
      5. 7.4.5 Thermostat Mode (TM)
        1. 7.4.5.1 Comparator Mode (TM = 0)
        2. 7.4.5.2 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1/F0)
        5. 7.5.3.5 Converter Resolution (R1 and R0)
        6. 7.5.3.6 One-Shot (OS)
        7. 7.5.3.7 Extended Mode (EM)
        8. 7.5.3.8 Alert (AL)
        9. 7.5.3.9 Conversion Rate (CR)
      4. 7.5.4 High- and Low-Limit Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Calibrating for Improved Accuracy (TMP112-Q1 Only)
        1. 8.1.1.1 Example 1: Finding Worst-Case Accuracy From –15°C to 50°C
        2. 8.1.1.2 Example 2: Finding Worst-Case Accuracy From 25°C to 100°C
      2. 8.1.2 Using The Slope Specifications With a 1-Point Calibration (TMP112-Q1 Only)
        1. 8.1.2.1 Power Supply-Level Contribution to Accuracy
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.2.2 Detailed Design Procedure

Place the TMP112-Q1/TMP112D-Q1 device in close proximity to the heat source that must be monitored, with a proper layout for good thermal coupling. This placement verifies that temperature changes are captured within the shortest possible time interval. To maintain accuracy in applications that require air or surface temperature measurement, care must be taken to isolate the package and leads from ambient air temperature. A thermally-conductive adhesive is helpful in achieving accurate surface temperature measurement.

The TMP112-Q1/TMP112D-Q1 device is a very low-power device and generates very low noise on the supply bus. Applying an RC filter to the V+ pin of the TMP112-Q1/TMP112D-Q1 device can further reduce any noise that the TMP112-Q1/TMP112D-Q1 device can propagate to other components. R(F) in Figure 8-5 must be less than 5kΩ and C(F) must be greater than 10nF.

TMP112-Q1 TMP112D-Q1 Noise Reduction Techniques (for SOT563-6 Package as an Example)Figure 8-5 Noise Reduction Techniques (for SOT563-6 Package as an Example)