SLUSC82B April   2017  – July 2026 UCC24630

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Start Up and UVLO
      2. 6.3.2 Volt-Sec SR Driver On-Time Control
      3. 6.3.3 CCM Dead Time
      4. 6.3.4 Standby Operation
      5. 6.3.5 Pin Fault Protection
        1. 6.3.5.1 VPC Pin Overvoltage
        2. 6.3.5.2 VPC Pin Open
        3. 6.3.5.3 VSC Pin Open
        4. 6.3.5.4 TBLK Pin Open
        5. 6.3.5.5 VPC and VSC Short to Ground
        6. 6.3.5.6 TBLK Pin Short to Ground
    4. 6.4 Device Functional Modes
      1. 6.4.1 Start-Up
      2. 6.4.2 Normal Operation
      3. 6.4.3 Standby Operation
      4. 6.4.4 Conditions to Stop Operation
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 AC-to-DC Adapter, 19.5V, 65W
      2. 7.2.2 Design Requirements
      3. 7.2.3 Calculation of Component Values
        1. 7.2.3.1 VPC Input
        2. 7.2.3.2 VSC Input
        3. 7.2.3.3 TBLK Input
      4. 7.2.4 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
        1. 7.5.1.1 VDD Pin
        2. 7.5.1.2 VPC Pin
        3. 7.5.1.3 VSC Pin
        4. 7.5.1.4 GND Pin
        5. 7.5.1.5 TBLK Pin
        6. 7.5.1.6 DRV Pin
      2. 7.5.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
        1. 8.1.1.1 Definition of Terms
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Electrical Characteristics

Over operating free-air temperature range, VDD = 12V, TA = –40°C to 125°C, TA = TJ (unless otherwise noted)
PARAMETERTEST CONDITIONMINTYPMAXUNIT
SUPPLY INPUT
IRUNSupply current, runIDRV = 0, run state, FSW = 0kHz0.91.2mA
ISTBYSupply current, standbyIDRV = 0, standby mode110160µA
UNDER-VOLTAGE LOCKOUT
VVDD(on)VDD turn-on thresholdVVDD low to high3.944.3V
VVDD(off)VDD turn-off thresholdVVDD high to low3.33.63.7V
DRV
RDRVLSDRV low-side drive resistanceIDRV = 100mA12Ω
VDRVSTDRV pull down in start-upVDD= 0 to 2V, IDRV= 10 µA0.95V
VDRCLDRV clamp voltageVVDD = 30V111315V
VPMOSDisable PMOS high-side driveVDD voltage to disable rail-to-rail drive, VDD rising9.31010.5V
VPMOS-HYSPMOS enable hysteresisVDD voltage hysteresis to enable rail to rail drive, VDD falling0.7511.25V
VDRHIDRV pull-up high voltageVVDD = 5V, IDRV = 15mA4.64.755V
VSC INPUT
VVSCENSR enable voltageVVSC > VVSCEN, VVSC rising250300340mV
VVSC-HYSSR enable hysteresisVVSC falling50mV
VVSCDISSR disable voltage220280mV
IVSCInput bias currentVVSC = 2V–0.2500.4µA
VPC INPUT
VVPCENSR enable voltageVVPCEN < VVPC345400450mV
VVPCDISVPC threshold to disable SRVVPC > VVPCDIS2.62.853.1V
VVPC-THThreshold of VVPC rising edgeVVPC = 0.95V, VVPC-TH = 0.85x VVPC previous cycle0.760.8080.86V
VVPC-TH-CLPClamp threshold of VVPC rising edgeVVPC = 2V0.911.1V
IVPCInput bias currentVVPC = 2V–0.2500.4µA
CURRENT EMULATOR
RatioVPC_VSCKVPC/KVSCVVPC = 1.25V, tVPC = 1µs,
VVSC = 1.25V
3.974.174.35
VVPC = 1.25V, tVPC = 5µs,
VVSC = 1.25V
3.954.174.37
VVPC = 2V, tVPC = 1µs,
VVSC = 1.25V
3.854.094.26
VVPC = 1.25V, tVPC = 1µs,
VVSC = 0.45V
3.854.074.28
CCM DEAD TIME
KCCM-FAULTIf tSW (N+1) > tSW (N) x KCCM-FAULT, disable SR140%150%165%
nCCM-FLTNumber of cycles to exit CCM fault if tSW (N+1) < tSW (N) x KCCM-FAULT4
STANDBY OPERATION
nENTONumber of switching cycles to enter standby operation during tENTO64
nENNumber of switching cycles to exit standby operation during tEN(1)32
OVER TEMPERATURE PROTECTION
T(STOP)Thermal shutdown temperatureInternal junction temperature165°C
The device exits standby operation as soon as nEN occurs within tEN.