SLUSEE5E January   2022  – April 2026 TPS4811-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 ESD Ratings
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Charge Pump and Gate Driver output (VS, PU, PD, BST, SRC)
      2. 8.3.2 Capacitive Load Driving
        1. 8.3.2.1 FET Gate Slew Rate Control
        2. 8.3.2.2 Using Precharge FET - (with TPS48111Q1 Only)
      3. 8.3.3 Overcurrent and Short-Circuit Protection
        1. 8.3.3.1 Overcurrent Protection With Auto-Retry
        2. 8.3.3.2 Overcurrent Protection With Latch-Off
        3. 8.3.3.3 Short-Circuit Protection
      4. 8.3.4 Analog Current Monitor Output (IMON)
      5. 8.3.5 Overvoltage (OV) and Undervoltage Protection (UVLO)
      6. 8.3.6 Remote Temperature sensing and Protection (DIODE)
      7. 8.3.7 Output Reverse Polarity Protection
      8. 8.3.8 TPS4811x-Q1 as a Simple Gate Driver
    4. 8.4 Device Functional Mode (Shutdown Mode)
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application: Driving HVAC PTC Heater Load on KL40 Line in Power Distribution Unit
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selection of Current Sense Resistor, RSNS
        2. 9.2.2.2 Selection of Scaling Resistor, RSET
        3. 9.2.2.3 Programming the Overcurrent Protection Threshold - RIWRN Selection
        4. 9.2.2.4 Programming the Short-Circuit Protection Threshold - RISCP Selection
        5. 9.2.2.5 Programming the Fault Timer Period - CTMR Selection
        6. 9.2.2.6 Selection of MOSFET, Q1
        7. 9.2.2.7 Selection of Bootstrap Capacitor, CBST
        8. 9.2.2.8 Setting the Undervoltage Lockout and Overvoltage Set Point
        9. 9.2.2.9 Choosing the Current Monitoring Resistor, RIMON
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application: Driving B2B FETs With Pre-Charging the Output Capacitance
      1. 9.3.1 Design Requirements
      2. 9.3.2 External Component Selection
        1. 9.3.2.1 Selection of Pre-Charge Resistor
      3. 9.3.3 Application Curves
    4. 9.4 Typical Application: Designing for EMI
      1. 9.4.1 Common EMI Components
      2. 9.4.2 Programming the Overcurrent Protection Threshold with Added DC Resistance - RIWRN
      3. 9.4.3 Choosing the Current Monitoring Resistor with Added DC Resistance - RIMON
      4. 9.4.4 Programming the Short Circuit Protection Threshold with Added DC Resistance - RISCP
    5. 9.5 Power Supply and EMI Recommendations
    6. 9.6 Layout
      1. 9.6.1 Layout Guidelines
      2. 9.6.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

11 Revision History

Changes from Revision D (April 2024) to Revision E (April 2026)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed storage temperature minimum from: −40°C to: −55°CGo
  • Added voltage slew rate on drain side input pins (VS, CS+, CS–, ISCP)Go
  • Added I(CS−) input bias currentGo
  • Updated Figure 8-6 Go
  • Changed charge pump voltage reference from: 11V to: 12VGo
  • Added Overcurrent and Short-Circuit Protection sectionGo
  • Moved Equation 6 from: Detailed Design Procedure to: Overcurrent and Short-Circuit ProtectionGo
  • Updated Equation 6 to include comparator offset voltageGo
  • Added Figure 8-9 Go
  • Changed Equation 11 from: −600 to: −464Go
  • Moved Device Functional Mode (Shutdown Mode) after Feature DescriptionGo
  • Updated Equation 16 to include comparator offset voltageGo
  • Changed Equation 17 from: −600 to: −464Go
  • Changed calculated RISCP value from: 1.32kΩ to: 1.46kΩGo
  • Added Typical Application: Designing for EMIGo
  • Changed from: Power Supply Recommendations to: Power Supply and EMI RecommendationsGo
  • Updated Figure 9-19 to include RSET and RISCP connectionGo

Changes from Revision C (December 2022) to Revision D (April 2024)

  • Updated the DIODE sense TSD rising threshold, T(DIODE_TSD_rising), specification in the Electrical Characteristics sectionGo