SLUSG22 October   2025 UCC35131-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Insulation Specifications
    6. 6.6 Electrical Characteristics
    7. 6.7 Safety-Related Certifications
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Pre-Production Samples Operating Limits
    3. 7.3 Functional Block Diagram
    4. 7.4 Feature Description
      1. 7.4.1 Power Stage Operation
        1. 7.4.1.1 VDD-COM Voltage Regulation
        2. 7.4.1.2 COM-VEE Voltage Regulation
      2. 7.4.2 Output Voltage Soft Start
      3. 7.4.3 ENA and Power-Good
      4. 7.4.4 Protection Functions
        1. 7.4.4.1 Input Undervoltage Lockout
        2. 7.4.4.2 Input Overvoltage Lockout
        3. 7.4.4.3 Output Undervoltage Protection
        4. 7.4.4.4 Output Overvoltage Protection
        5. 7.4.4.5 Over-Temperature Protection
        6. 7.4.4.6 BSW Pin Faults Protection
    5. 7.5 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 VDD-COM Voltage Regulation
        2. 8.2.2.2 COM-VEE Voltage Regulation and Single Output Configuration
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

TI recommends to install the device with JEDEC standard J-STD-020 reflow process. The peak solder temperature should not exceed 260oC. If manual installation is needed durning testing process, TI recommends to limit the peak temperature not exceeding 260oC.