SLVAEU0A September   2020  – November 2025 LM117HVQML-SP , LM117QML-SP , LM136A-2.5QML-SP , LM137JAN-SP , LM137QML-SP , LM185-1.2QML-SP , LM185-2.5QML-SP , LM2940QML-SP , LM2941QML-SP , LM4050QML-SP , LM723JAN-SP , LP2953QML-SP , TL1431-SP , TPS50601-SP , TPS50601A-SP , TPS7A4501-SP , TPS7H1101-SP , TPS7H1101A-SP , TPS7H1111-SP , TPS7H1121-SP , TPS7H2201-SP , TPS7H2211-SP , TPS7H3301-SP , TPS7H4001-SP , TPS7H4002-SP , TPS7H4011-SP , TPS7H5001-SP , TPS7H5002-SP , TPS7H5003-SP , TPS7H5004-SP , TPS7H6003-SP , TPS7H6013-SP , TPS7H6023-SP , UC1525B-SP , UC1611-SP , UC1705-SP , UC1707-SP , UC1708-SP , UC1709-SP , UC1710-SP , UC1715-SP , UC1823A-SP , UC1825-SP , UC1825A-SP , UC1825B-SP , UC1832-SP , UC1834-SP , UC1842-SP , UC1842A-SP , UC1843-SP , UC1843A-SP , UC1843B-SP , UC1844-SP , UC1844A-SP , UC1845-SP , UC1845A-SP , UC1846-SP , UC1856-SP , UC1863-SP , UC1875-SP , UC1901-SP , UC19432-SP , UCC1806-SP

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Reflow Profiles
  5. 2Critical Considerations for Gold-Plated Termination-Finishes
  6. 3Considerations for Leadless Ceramic Chip Carrier Packages
  7. 4Lead Forming
  8. 5Ceramic Packaging
  9. 6References
  10. 7Revision History

3 Considerations for Leadless Ceramic Chip Carrier Packages

The critical items for board-level solder process for a Leadless Ceramic Chip Carrier (LCCC) package are solder paste thickness and depth of package insertion into the paste during pick and place.

  • If the paste under the package is too thin, this results in in a poor solder joint.
  • Too much solder paste can cause excess solder on the sides of the package.
  • If the package is placed too far into the paste (too close to the board) it can cause excess solder on the sides of the package.
  • The solder must adhere to the pads on the package backside and flow up the castellation.
  • The package must be parallel to the board (no tilt).
  • The package must be aligned to the pads.
  • The circuit board pads must be sized to fit the pads on the underside of the package and allow for a fillet on the sides.
  • Placement depth must be consistent.
  • With mixed package types on the board the actual reflow temperature of the LCCC component must be measured (thermocouple on package via thermally conductive epoxy).