The TPS50601A-SP is a radiation hardened, 7-V, 6-A synchronous step-down converter, which is optimized for small designs through high efficiency and integrating the high-side and low-side MOSFETs. Further space savings are achieved through current mode control, which reduces component count, and a high switching frequency, reducing the inductor’s footprint. The devices are offered in an ultra small, thermally enhanced 20-pin ceramic flatpack package.
The output voltage startup ramp is controlled by the SS/TR pin which allows operation as either a stand alone power supply or in tracking situations. Power sequencing is also possible by correctly configuring the enable and the open drain power good pins. In addition, the TPS50601A-SP can be configured in master-slave mode to provide up to 12-A of output current.
Cycle-by-cycle current limiting on the high-side FET protects the device in overload situations and is enhanced by a low-side sourcing current limit which prevents current runaway. There is also a low-side sinking current limit which turns off the low-side MOSFET to prevent excessive reverse current. Thermal shutdown disables the part when die temperature exceeds thermal shutdown temperature.
For additional terms or required resources, click any title below to view the detail page where available.
The ADC12DJ3200EVMCVAL is an evaluation module (EVM) that evaluates the ADC12DJ3200QML-SP device. ADC12DJ3200QML-SP is a space-grade, low-power, 12-bit, dual 3.2-GSPS/single 6.4-GSPS, RF-sampling analog-to-digital converter (ADC) with a buffered analog input, integrated digital down converter (...)
The TPS50601A-SP is a radiation hardened, 7-V, 6-A synchronous step-down converter, which is optimized for small designs through high efficiency and integrating the high-side and low-side MOSFETs. The device offers optimum electrical and radiation performance in a very small, thermally (...)
The TSW12D1620EVM-CVAL is a 1.5-GHz wideband receiver evaluation module (EVM) that includes ceramic engineering models of the amplifier, analog-to-digital converter (ADC), clocking, temperature sensor, microcontroller, and power solution. The board is best suited for (...)
As FPGA and ASIC technology advances, the core voltage requirements get lower but the current demand is larger. The newest space grade FPGAs and ASICS require low voltage and high currents for their core power consumption. These high current (...)
| Package | Pins | Download |
|---|---|---|
| (KGD) | 0 | View options |
| CFP (HKH) | 20 | View options |
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.
