SLVSHH0 June   2026 TPS61290

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Voltage Setting
      2. 7.3.2 Switching Frequency and Spread Spectrum Function
    4. 7.4 Device Functional Modes
      1. 7.4.1  Enable and Start-Up
      2. 7.4.2  Operation Mode Setting
      3. 7.4.3  Bypass Mode
      4. 7.4.4  Boost Control Operation
      5. 7.4.5  Auto PFM Mode
      6. 7.4.6  Forced PWM Mode
      7. 7.4.7  Output Discharge
      8. 7.4.8  Undervoltage Lockout
      9. 7.4.9  Current Limit Operation
      10. 7.4.10 Output Short-to-Ground Protection
      11. 7.4.11 Thermal Shutdown
      12. 7.4.12 Power-Good Indication Status
    5. 7.5 Programming
      1. 7.5.1 Data Validity
      2. 7.5.2 START and STOP Conditions
      3. 7.5.3 Byte Format
      4. 7.5.4 Acknowledge (ACK) and Not Acknowledge (NACK)
      5. 7.5.5 Target Address and Data Direction Bit
      6. 7.5.6 Single Read and Write
      7. 7.5.7 Multi-Read and Multi-Write
  9. Register Maps
    1. 8.1 DeviceID Register
    2. 8.2 CONFIG Register
    3. 8.3 VOUTFLOORSET Register
    4. 8.4 ILIMBSTSET Register
    5. 8.5 VOUTROOFSET Register
    6. 8.6 STATUS Register
    7. 8.7 ILIMPTSET Register
    8. 8.8 BSTLOOP Register
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 TPS61290x With 2.5V – 4.35V VIN, 3.4V VOUT, 6A Output Current
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Inductor Selection
          2. 9.2.1.2.2 Output Capacitor
          3. 9.2.1.2.3 Input Capacitor
          4. 9.2.1.2.4 Checking Loop Stability
        3. 9.2.1.3 Application Curves
      2. 9.2.2 TPS61290x With 2.5V – 4.85V VIN, 5.0V VOUT, 4A Output Current
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Thermal Information
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     81

Pin Configuration and Functions

TPS61290 TPS61290x YBG Package, 16-Pin DSBGA (Top
                        View)Figure 5-1 TPS61290x YBG Package, 16-Pin DSBGA (Top View)
TPS61290 TPS61290x YBG Package, 16-Pin DSBGA (Bottom
                        View)Figure 5-2 TPS61290x YBG Package, 16-Pin DSBGA (Bottom View)
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
EN A1 I Enable logic input. Logic high voltage enables the device. Logic low voltage disables the device and turns the device into shutdown mode.
SCL B1 I Serial interface clock line. Terminate this pin and do not leave this pin floating.
SDA C1 I Serial interface address/data line. Terminate this pin and do not leave this pin floating.
GPIO D1 I/O Configure the pin as ADDR or VSEL function. For TPS61290, the default configuration is ADDR function. For TPS612901, the default configuration is VSEL function.
ADDR: I2C target address selection. I2C target address is 75h when ADDR is low, I2C target address is 76h when ADDR is high, I2C target address is 77h when ADDR is floating. The address is locked when the start-up sequence is successfully completed.
VSEL: DC/DC boost or bypass threshold selection pin (see also Section 7.3.1).
VIN A2, A3, A4 PWR Power supply input
VOUT B2, B3, B4 PWR Boost converter output
SW C2, C3, C4 PWR The switch pin of the converter. This pin is connected to the drain of the internal low-side power MOSFET and the source of the internal high-side power MOSFET.
GND D2, D3, D4 PWR Ground pin of the IC. The GND pad of output capacitor must be close to the GND pin. Layout example is shown in Layout Example.
I = input, O = output, PWR = power