SLVSHM2A March   2025  – August 2025 TPS2HC120-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Current and Voltage Conventions
      2. 7.3.2 Low Power Mode
      3. 7.3.3 Accurate Current Sense
      4. 7.3.4 Adjustable Current Limit
      5. 7.3.5 Inductive-Load Switching-Off Clamp
      6. 7.3.6 Fault Detection and Reporting
        1. 7.3.6.1 Diagnostic Enable Function
        2. 7.3.6.2 Multiplexing of Current Sense
        3. 7.3.6.3 FAULT Reporting
        4. 7.3.6.4 Fault Table
      7. 7.3.7 Full Diagnostics
        1. 7.3.7.1 Short-to-GND and Overload Detection
        2. 7.3.7.2 Open-Load Detection
          1. 7.3.7.2.1 Channel On
          2. 7.3.7.2.2 Channel Off
        3. 7.3.7.3 Short-to-Battery Detection
        4. 7.3.7.4 Reverse-Polarity and Battery Protection
        5. 7.3.7.5 Thermal Fault Detection
          1. 7.3.7.5.1 Thermal Protection Behavior
      8. 7.3.8 Full Protections
        1. 7.3.8.1 UVLO Protection
        2. 7.3.8.2 Loss of GND Protection
        3. 7.3.8.3 Loss of Power Supply Protection
        4. 7.3.8.4 Reverse Battery Protection
        5. 7.3.8.5 Protection for MCU I/Os
    4. 7.4 Device Functional Modes
      1. 7.4.1 Working Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 EMC Transient Disturbances Test
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
        1. 8.5.2.1 Without a GND Network
        2. 8.5.2.2 With a GND Network
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5 Pin Configuration and Functions

TPS2HC120-Q1 DGQ Package, 28-Pin HVVSOP (Top View)
NC – No internal connection.
DNC – With internal connection. Do not connect externally.
Figure 5-1 DGQ Package, 28-Pin HVVSOP (Top View)

See Section 8 for full list of recommended components.

Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1, 14, 17, 18, 19, 24, 25, 26 NC N/A No internal connection.
2 EN1 I Input control for channel 1 activation, internal pulldown.
3 EN1_AUX I Auxiliary input control for channel 1 activation, internal pulldown. Internally OR'd with EN1. Connect to GND if not using.
4 EN2_AUX I Auxiliary input control for channel 2 activation, internal pulldown. Internally OR'd with EN2. Connect to GND if not using.
5 EN2 I Input control for channel 2 activation, internal pulldown.
6 DNC — Leave floating.
7 SEL I SNS channel-selection low bit; internal pulldown.
8 DIAG_EN I Enable-disable pin for diagnostics, internal pulldown.
9 FLT O Open drain global fault output. Referred to FAULT, FLT, or fault pin. Recommended 5-10kΩ pullup resistor
10 LPM O Open drain LPM status pin. Pulled high by external supply if the device is in LPM or SLEEP state. Pulled low internally when device is in ACTIVE mode. Recommended 5-10kΩ pullup resistor.
11 SNS O SNS current output
12 ILIM O Adjustable current limit. Connect a resistor to chip GND, SHORT the pin to chip GND, or leave the pin OPEN to set the current limit value.
13 GND Power Ground of device. Connect to resistor- diode ground network to have reverse battery protection.
15,16 VOUT2 Power Output of channel 2 of the high side switch, connected to load.
20, 21, 22, 23 VBB Power Power supply.
27,28 VOUT1 Power Output of channel 1 of the high side switch, connected to load.
Thermal Pad Pad — Thermal pad for the die to dissipate the heat. Connect the pad to GND pin. See the layout example section for more information.