SLVSI46 July   2025 DRV8818A

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7.     13
    8. 5.7 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 PWM H-Bridge Drivers
      2. 6.3.2 Current Regulation
      3. 6.3.3 Decay Mode
      4. 6.3.4 Microstepping Indexer
      5. 6.3.5 Protection Circuits
        1. 6.3.5.1 Overcurrent Protection (OCP)
        2. 6.3.5.2 Thermal Shutdown (TSD)
        3. 6.3.5.3 Undervoltage Lockout (UVLO)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode
      2. 6.4.2 Disable Mode
      3. 6.4.3 Active Mode
  8. 7Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Stepper Motor Speed
        2. 7.2.2.2 Current Regulation VREF and RSENSE
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Bulk Capacitance
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Heat Sinking
      2. 7.4.2 Layout Example
      3. 7.4.3 Thermal Considerations
        1. 7.4.3.1 Power Dissipation
  9. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
    6. 8.6 Documentation Support
      1. 8.6.1 Related Documentation
  10.   Mechanical, Packaging, and Orderable Information

Power Dissipation

Power dissipation in the DRV8818A is dominated by the power dissipated in the output FET resistance, or RDS(ON). Average power dissipation when running a stepper motor can be roughly estimated by:

Equation 9. DRV8818A

where

  • PTOT is the total power dissipation.
  • RDS(ON) is the resistance of each FET.
  • IOUT(RMS) is the RMS output current being applied to each winding.

IOUT(RMS) is equal to approximately 0.7x the full-scale output current setting. The factor of 4 comes from the two motor windings, and at any instant two FETs are conducting winding current for each winding (one high-side and one low-side).

The maximum amount of power that can be dissipated in the DRV8818A is dependent on ambient temperature and heat sinking. The thermal dissipation ratings table in the data sheet can be used to estimate the temperature rise for typical PCB constructions.

Note that RDS(ON) increases with temperature, so as the device heats, the power dissipation increases. This must be taken into consideration when sizing the heat sink.