SLVSI75 May   2026 DRV8218

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Transient Current Capability
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 External Components
    4. 7.4 Feature Description
      1. 7.4.1 Control Modes
        1. 7.4.1.1 PWM Control Mode (MODE = 0)
        2. 7.4.1.2 PH/EN Control Mode (MODE = 1)
        3. 7.4.1.3 Independent Half-Bridge Control Mode (MODE = Hi-Z)
      2. 7.4.2 Pin Diagrams
        1. 7.4.2.1 Logic-Level Inputs
        2. 7.4.2.2 Tri-Level Input
      3. 7.4.3 Protection Circuits
        1. 7.4.3.1 Supply Undervoltage Lockout (UVLO)
        2. 7.4.3.2 OUTx Overcurrent Protection (OCP)
        3. 7.4.3.3 Thermal Shutdown (TSD)
    5. 7.5 Device Functional Modes
      1. 7.5.1 Active Mode
      2. 7.5.2 Low-Power Sleep Mode
      3. 7.5.3 Fault Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Full-Bridge Driving
        1. 8.2.1.1 Supply Voltage
        2. 8.2.1.2 Control Interface - Full Bridge
        3. 8.2.1.3 Low-Power Operation
        4. 8.2.1.4 Application Curves
      2. 8.2.2 Half-Bridge Driving
        1. 8.2.2.1 Control Interface
        2. 8.2.2.2 Low-Power Operation
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Parallel Multiple Drivers
      4. 8.2.4 Dual-Coil Relay Driving
        1. 8.2.4.1 Control Interface
        2. 8.2.4.2 Low-Power Operation
        3. 8.2.4.3 Application Curves
      5. 8.2.5 Current Sense
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Detailed Design Procedure
          1. 8.2.5.2.1 Shunt Resistor Sizing
          2. 8.2.5.2.2 RC Filter
    3. 8.3 Current Capability and Thermal Performance
      1. 8.3.1 Power Dissipation and Output Current Capability
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Bulk Capacitance
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

8.5.1 Layout Guidelines

Since the DRV8218 device has integrated power MOSFETs capable of driving high current, careful attention must be paid to the layout design and external component placement. Some design and layout guidelines are provided below. For more information on layout recommendations, please see the application note Best Practices for Board Layout of Motor Drivers.

  • Bypass the VM and VCC pins to GND using low-ESR ceramic bypass capacitors. A capacitance of 0.1uF and X5R and X7R types are recommended. For best results, place these capacitors as close to the device as possible to minimize the loop inductance.
  • The VM power supply bulk capacitor can be of ceramic or electrolytic type, and is also recommended to be placed as close as possible to the device to minimize the loop inductance.
  • VM, OUT1, OUT2, and GND carry the high current from the power supply to the outputs and back to ground. Utilize thick metal routing or custom polygon pours for these traces if feasible.
  • Connect the device thermal pad to the PCB top layer ground plane and internal ground plane (when available) through thermal vias to maximize the PCB heat sinking.
  • Maximize the copper plane area attached to the thermal pad for heat sinking.
  • See Application Note - Best Practices for Board Layout of Motor Drivers for more information on thermal management, routing techniques, capacitor placement, and grounding optimization for motor drivers.