SLVSIB0 December   2025 UCD91320

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Linearity Parameters
    7. 5.7 POR and BOR
    8. 5.8 Low Frequency Crystal/Clock
    9. 5.9 Flash Memory Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Feature Description
      1. 6.2.1 TI Sequencer Studio Software
      2. 6.2.2 PMBUS Interface
      3. 6.2.3 PMBUS Security
    3. 6.3 Device Functional Modes
      1. 6.3.1 Black Box Fault Logging
      2. 6.3.2 PMBus Address Selection
      3. 6.3.3 Brownout
    4.     Failure Analysis and Returns
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.8 Low Frequency Crystal/Clock

over operating free-air temperature range (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Low frequency crystal oscillator (LFXT)
fLFXTLFXT frequency32768Hz
DCLFXTLFXT duty cycle3070%
OALFXTLFXT crystal oscillation allowance419kΩ
CL, effIntegrated effective load capacitance(1)1pF
tstart, LFXTLFXT start-up time483640ms
(1) The integrated effective load capacitance includes parasitic bond and package capacitance (≈2pF per pin), calculated as CLFXIN×CLFXOUT/(CLFXIN+CLFXOUT), where CLFXIN and CLFXOUT are the total capacitance at LFXIN and LFXOUT, respectively.