SLVSIB0 December   2025 UCD91320

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Linearity Parameters
    7. 5.7 POR and BOR
    8. 5.8 Low Frequency Crystal/Clock
    9. 5.9 Flash Memory Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Feature Description
      1. 6.2.1 TI Sequencer Studio Software
      2. 6.2.2 PMBUS Interface
      3. 6.2.3 PMBUS Security
    3. 6.3 Device Functional Modes
      1. 6.3.1 Black Box Fault Logging
      2. 6.3.2 PMBus Address Selection
      3. 6.3.3 Brownout
    4.     Failure Analysis and Returns
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
VDDSupply voltageAt VDD pin–0.34.1V
VIInput voltageApplied to any 5V tolerant open-drain pins–0.35.5V
VIInput voltageApplied to any common tolerance pins–0.3VDD + 0.3 (4.1 MAX)V
IVDDCurrent into VDD pin (source)
-40℃ ≤ Tj ≤ 130℃

80mA
Current into VDD pin (source)-40℃ ≤ Tj ≤ 85℃100mA
IVSSCurrent out of VSS pin (sink)
-40℃ ≤ Tj ≤ 130℃

80mA
Current out of VSS pin (sink)-40℃ ≤ Tj ≤ 85℃100mA
IIOCurrent of device pinCurrent sunk or sourced by device pin6mA
IDSupported diode currentDiode current at any device pin except VREF-±2(3)mA
TJJunction temperatureJunction temperature-40130°C
TstgStorage temperature(2)Storage temperature(2)–40150°C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) Apply higher temperatures during board soldering according to the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
(3) VREF- has an internal connection for testing purposes, there is no injection current allowed on this pin.