SLVSL52 September   2026 XTR100

ADVMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 ESD Protection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Zero-Drift Clocking
      2. 7.1.2 Basic Functionality in Loop-Powered Transmitters
      3. 7.1.3 Current Consumption
      4. 7.1.4 System Error Estimation
    2. 7.2 Typical Applications
      1. 7.2.1 XTR100 4mA – 20mA Transmitter
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
      2. 7.2.2 XTR100 4mA – 20mA Low Voltage Transmitter
      3. 7.2.3 XTR100 Precision Divider and Adder
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 PSpice® for TI
        2. 8.1.1.2 TINA-TI™ Simulation Software (Free Download)
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) XTR100 XTR102/XTR120 UNIT
DBV (SOT-23) DQC (WSON)
6 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 179.9 65.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 110.5 65.1 °C/W
RθJB Junction-to-board thermal resistance 87.9 27.3 °C/W
ΨJT Junction-to-top characterization parameter 50.7 2.6 °C/W
ΨJB Junction-to-board characterization parameter 87.6 27.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 14.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.