SLVSLK0 May   2026 TPSI8830

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Configurable Fault Response Timer (TMR)
        1. 8.3.1.1 Fault Latch-OFF
        2. 8.3.1.2 Fault Auto-Retry
      2. 8.3.2 Over-Current Protection (OCP)
      3. 8.3.3 Thermal Shutdown
      4. 8.3.4 Zero-Cross Turn On
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Thermostat
      2. 9.2.2 System Level Testing
      3. 9.2.3 Design Requirements
      4. 9.2.4 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 EMI Considerations
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Thermal Shutdown

When the junction temperature rises up beyond TABS_R the device disables the power path and send a fault signal back to the primary side. After the thermal shutdown is triggered, the FAULT pin is asserted low. The device follows the behavior programmed by TMR (Latch-off or auto-retry). A TVS or other clamping circuit is recommended to absorb any inductive energy from the load when the device shuts down.