SLVUD73 April   2025 TPS7H3014-SEP , TPS7H3014-SP

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
      1. 1.3.1 Alternate Board Configurations
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Important Usage Notes
    3. 2.3 Connector Descriptions
  7. 3Implementation Results
    1. 3.1 Default Configuration Results
    2. 3.2 Sequence UP and DOWN Thresholds
    3. 3.3 Delay Timer
    4. 3.4 Regulation Timer
    5. 3.5 Disabled Channels
    6. 3.6 Externally Induced System RESET
  8. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials (BOM)
  9. 5Compliance Information
    1. 5.1 Compliance and Certifications
  10. 6Related Documentation

4.2 PCB Layout

TPS7H3014EVM Top OverlayFigure 4-2 Top Overlay
TPS7H3014EVM Top Solder MaskFigure 4-3 Top Solder Mask
TPS7H3014EVM Layer 1 (Top)Figure 4-4 Layer 1 (Top)
TPS7H3014EVM Layer 2Figure 4-5 Layer 2
TPS7H3014EVM Layer 3Figure 4-6 Layer 3
TPS7H3014EVM Layer 4 (Bottom)Figure 4-7 Layer 4 (Bottom)
TPS7H3014EVM Bottom Solder MaskFigure 4-8 Bottom Solder Mask
TPS7H3014EVM Bottom OverlayFigure 4-9 Bottom Overlay
TPS7H3014EVM Drill DrawingFigure 4-10 Drill Drawing