SLVUD74A
April 2025 – June 2025
LM72880-Q1
1
Description
Get Started
Features
Applications
6
1
Evaluation Module Overview
1.1
Introduction
1.2
Kit Contents
1.3
Specification
1.4
Device Information
2
Hardware
2.1
Test Setup and Procedure
2.1.1
EVM Connections
2.1.2
Test Equipment
2.1.3
Recommended Test Setup
2.1.3.1
Input Connections
2.1.3.2
Output Connections
2.1.3.3
I2C Connections
2.1.4
Test Procedure
2.1.4.1
Graphic User Interface (GUI)
2.1.4.1.1
Quick Overview
2.1.4.2
Basic Test Procedure
3
Implementation Results
3.1
Test Data and Performance Curves
3.1.1
Efficiency
3.1.2
Operating Waveforms
3.1.2.1
Start-Up and Shutdown
3.1.2.2
Switching
3.1.2.3
Load Transient (CV), ISET Modulation (CC)
3.1.3
Thermal Performance
3.1.4
EMI Performance
4
Hardware Design Files
4.1
Schematic
4.2
PCB Layout
4.3
Bill of Materials
5
Additional Information
5.1
Trademarks
6
Device and Documentation Support
6.1
Device Support
6.1.1
Development Support
6.2
Documentation Support
6.2.1
Related Documentation
6.2.1.1
PCB Layout Resources
6.2.1.2
Thermal Design Resources
7
Revision History
6.2.1.2
Thermal Design Resources
Texas Instruments,
AN-2020 Thermal Design by Insight, Not Hindsight
application note
Texas Instruments,
AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
application note
Texas Instruments,
Semiconductor and IC Package Thermal Metrics
application note
Texas Instruments,
Thermal Design Made Simple with LM43603 and LM43602
application note
Texas Instruments,
PowerPAD™
Thermally Enhanced Package
application note
Texas Instruments,
PowerPAD™
Made Easy
application brief
Texas Instruments,
Using New Thermal Metrics
application note