SLVUDB4 September   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Connector, Jumper, DIP switch and Test point Description
      1. 2.1.1 Connector Descriptions
      2. 2.1.2 Jumper Descriptions
      3. 2.1.3 DIP Switch Descriptions
      4. 2.1.4 Test Points Description
      5. 2.1.5 Easy to Use Features
  9. 3Implementation Results
    1. 3.1 Test Setup and Procedure
      1. 3.1.1 Test Setup
      2. 3.1.2 Configurations for Stacking Two EVMs
      3. 3.1.3 Test Procedure
      4. 3.1.4 Precautions
    2. 3.2 Performance Data and Results
      1. 3.2.1 Efficiency
      2. 3.2.2 Steady State Waveforms
      3. 3.2.3 Step Load Response
      4. 3.2.4 AC Loop Response Curve
      5. 3.2.5 Thermal Performance
  10. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layers
    3. 4.3 Bill of Materials
  11. 5Additional Information
    1.     Trademarks

4.2 PCB Layers

LM5125AEVM-BST Top Silk Screen Figure 4-2 Top Silk Screen
LM5125AEVM-BST Bottom Silk Screen Figure 4-3 Bottom Silk Screen
LM5125AEVM-BST Top Layer Figure 4-4 Top Layer
LM5125AEVM-BST Signal Layer 1 Figure 4-5 Signal Layer 1
LM5125AEVM-BST Signal Layer 2 Figure 4-6 Signal Layer 2
LM5125AEVM-BST Signal Layer 3 Figure 4-7 Signal Layer 3
LM5125AEVM-BST Signal Layer 4 Figure 4-8 Signal Layer 4
LM5125AEVM-BST Bottom Layer Figure 4-9 Bottom Layer