SLVUDB4 September   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Connector, Jumper, DIP switch and Test point Description
      1. 2.1.1 Connector Descriptions
      2. 2.1.2 Jumper Descriptions
      3. 2.1.3 DIP Switch Descriptions
      4. 2.1.4 Test Points Description
      5. 2.1.5 Easy to Use Features
  9. 3Implementation Results
    1. 3.1 Test Setup and Procedure
      1. 3.1.1 Test Setup
      2. 3.1.2 Configurations for Stacking Two EVMs
      3. 3.1.3 Test Procedure
      4. 3.1.4 Precautions
    2. 3.2 Performance Data and Results
      1. 3.2.1 Efficiency
      2. 3.2.2 Steady State Waveforms
      3. 3.2.3 Step Load Response
      4. 3.2.4 AC Loop Response Curve
      5. 3.2.5 Thermal Performance
  10. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layers
    3. 4.3 Bill of Materials
  11. 5Additional Information
    1.     Trademarks

3.1.2 Configurations for Stacking Two EVMs

  1. Connect VIN, VOUT, GND from two EVMs together with short, thick cables, respectively.
  2. Connect J10 of the primary EVM and J9 of the secondary EVM with ribbon cable. Refer to Figure 3-2.
  3. If 3-phase interleaving operation is desired, select CFG2=Level 7 for the primary EVM. If 4-phase interleaving operation is desired, select CFG2=Level 9 for the primary EVM. Select CFG2=Level 15 for the secondary EVM.
LM5125AEVM-BST Connecting the Primary EVM and Secondary EVM with Ribbon CableFigure 3-2 Connecting the Primary EVM and Secondary EVM with Ribbon Cable