SLVUDF0 October   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Hardware Overview
    2. 2.2 Power Requirements
    3. 2.3 XDS110 Debug Probe
      1. 2.3.1 Isolation Jumper Block
      2. 2.3.2 Application (Backchannel) UART
    4. 2.4 Measure Current Draw of the MSPM0L2117
    5. 2.5 Clocking
    6. 2.6 BoosterPack Plug-in Module Pinout
    7. 2.7 Liquid Crystal Display (LCD)
  9. 3Software
    1. 3.1 Software Development Options
    2. 3.2 CCS Cloud
  10. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layers
    3. 4.3 Bill of Materials (BOM)
  11. 5Additional Information
    1. 5.1 Trademarks
  12. 6Related Documentation
    1. 6.1 Supplemental Content

2.6 BoosterPack Plug-in Module Pinout

The LaunchPad™ development kit adheres to the 40-pin LaunchPad development kit pinout standard, where pins are available. A standard was created to aid compatibility between the LaunchPad development kits and the BoosterPack™ plug-in modules across the TI ecosystem.

While most BoosterPack plug-in modules are compliant with the standard, some are not. If the reseller or owner of the BoosterPack plug-in module does not explicitly indicate compatibility with the LP-MSPM0L2117 LaunchPad development kit, then compare the schematic of the candidate BoosterPack plug-in module with the LaunchPad development kit to verify compatibility. Conflicts can be resolved by changing the MSPM0L2117 device pin function configuration in software.