SLVUDH5A September   2025  – November 2025

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 U1: Solder Reflow
    3. 1.3 Kit Contents
    4. 1.4 Specification
    5. 1.5 Device Information
  7. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Recommended Test Equipment
    3. 2.3 External Connections for Easy Evaluation
    4. 2.4 Test Points
    5. 2.5 Oscilloscope Probes: Probing the EVM
  8. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 PCB Layout Guidelines
    4. 3.4 PCB Layout Example
    5. 3.5 Bill of Materials (BOM)
    6.     Trademarks
  9. 4Revision History

3.4 PCB Layout Example

The PCB layout example, highlighted in the following figures, is based on the EVM schematic shown in Figure 3-1 and PCB layer images shown in Figure 3-4 to Figure 3-7.

UCC35131EVM-118 VIN (C2, C3) and VDD (C5, C8) Capacitors Figure 3-8 VIN (C2, C3) and VDD (C5, C8) Capacitors
UCC35131EVM-118 FBVDD (R6-7, C6), FBVEE (R5, C4), COMA Routing Figure 3-9 FBVDD (R6-7, C6), FBVEE (R5, C4), COMA Routing
UCC35131EVM-118 Thermal Vias Figure 3-10 Thermal Vias
UCC35131EVM-118 Isolation Keep Out Region Figure 3-11 Isolation Keep Out Region
UCC35131EVM-118 Bottom Side, Buck Boost, VEE LC Placement and Routing Figure 3-12 Bottom Side, Buck Boost, VEE LC Placement and Routing
UCC35131EVM-118 Top Side, Component Placement and Routing Figure 3-13 Top Side, Component Placement and Routing