SLVUDH5A September   2025  – November 2025

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 U1: Solder Reflow
    3. 1.3 Kit Contents
    4. 1.4 Specification
    5. 1.5 Device Information
  7. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Recommended Test Equipment
    3. 2.3 External Connections for Easy Evaluation
    4. 2.4 Test Points
    5. 2.5 Oscilloscope Probes: Probing the EVM
  8. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 PCB Layout Guidelines
    4. 3.4 PCB Layout Example
    5. 3.5 Bill of Materials (BOM)
    6.     Trademarks
  9. 4Revision History

2.5 Oscilloscope Probes: Probing the EVM

Using TP9-11 oscilloscope probe PCB test points: The UCC35131-Q1 is a high frequency DC-DC module that requires careful measurement for accurately capturing transient events and measuring high frequency, AC ripple voltage. Remove the "witch hat" probe tip cover and ground lead from the scope probe. If scope probe ground springs are not available, wrap a piece of 22 AWG bare wire around the scope probe ground ring or use a fitted ground spring and insert the probe tip and ground into the EVM as shown in Figure 2-2.

UCC35131EVM-118 PCB Scope Probe Test Points Figure 2-2 PCB Scope Probe Test Points

The EVM output nomenclature (VDD, VEE, COM) corresponds to what is commonly used when referring to isolated gate driver ICs. As shown in Figure 3-1, TP4 (COM) is the midpoint reference intended to connect to the COM pin of the isolated gate driver IC. When the UCC35131-Q1 is used to bias a gate driver IC, VDD (VDD-COM) and VEE (VEE-COM) are referred to with respect to COM.