SNIS118I July   1999  – October 2025 LM50 , LM50HV

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: LM50 (LM50B and LM50C)
    6. 6.6 Electrical Characteristics: LM50HV
    7. 6.7 Typical Characteristics (LM50B and LM50C)
    8. 6.8 Typical Characteristics (LM50HV)
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LM50 and LM50HVTransfer Function
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Full-Range Centigrade Temperature Sensor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitive Bypass and Loads
          2. 8.2.1.2.2 LM50HV Self-heating
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
      3. 8.5.3 Thermal Considerations
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1.      Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Typical Characteristics (LM50HV)

At TA = 25°C and +VS = 5V (unless otherwise noted)

LM50 LM50HV Accuracy vs Ambient Temperature
+VS = 5V and No ILoad  
Figure 6-21 Accuracy vs Ambient Temperature
LM50 LM50HV Accuracy vs Ambient Temperature with different loadsFigure 6-23 Accuracy vs Ambient Temperature with different loads
LM50 LM50HV Supply Current vs Ambient Temperature
Figure 6-25 Supply Current vs Ambient Temperature
LM50 LM50HV Load Regulation vs Ambient Temperature
+VS = 5V
Figure 6-27 Load Regulation vs Ambient Temperature
LM50 LM50HV Line Regulation vs Ambient Temperature
 
Figure 6-29 Line Regulation vs Ambient Temperature
LM50 LM50HV Thermal Response in Stirred Oil Bath (0.5 inches × 0.5 inches PCB board)
 2-layer 62-mil Rigid PCB 2oz. Copper
Figure 6-31 Thermal Response in Stirred Oil Bath (0.5 inches × 0.5 inches PCB board)
LM50 LM50HV Output Impedance vs Frequency
 TA = 25°C
Figure 6-33 Output Impedance vs Frequency
LM50 LM50HV Output Noise Density
 TA = 25°C
Figure 6-35 Output Noise Density
LM50 LM50HV VO vs Ambient TemperatureFigure 6-22 VO vs Ambient Temperature
LM50 LM50HV Change in Accuracy vs Temperature
Figure 6-24 Change in Accuracy vs Temperature
LM50 LM50HV Supply Current vs Supply Voltage
Figure 6-26 Supply Current vs Supply Voltage
LM50 LM50HV Change in Output Voltage vs Load Current
 TA = 25°C
Figure 6-28 Change in Output Voltage vs Load Current
LM50 LM50HV Start-up response to +VS = 3.3V
            Step (When tr = 1μs, No CLoad and CBy-pass)
Figure 6-30 Start-up response to +VS = 3.3V Step (When tr = 1μs, No CLoad and CBy-pass)
LM50 LM50HV Thermal Response in Still Air (0.5 inches × 0.5 inches PCB board)
 2-layer 62-mil Rigid PCB 2oz. Copper
Figure 6-32 Thermal Response in Still Air (0.5 inches × 0.5 inches PCB board)
LM50 LM50HV Power Supply Rejection Ratio vs Frequency
 TA = 25°C
Figure 6-34 Power Supply Rejection Ratio vs Frequency