SNIS118I July   1999  – October 2025 LM50 , LM50HV

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: LM50 (LM50B and LM50C)
    6. 6.6 Electrical Characteristics: LM50HV
    7. 6.7 Typical Characteristics (LM50B and LM50C)
    8. 6.8 Typical Characteristics (LM50HV)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LM50 and LM50HVTransfer Function
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Full-Range Centigrade Temperature Sensor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitive Bypass and Loads
          2. 8.2.1.2.2 LM50HV Self-heating
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
      3. 8.5.3 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1.      Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
8.2.1.2.2 LM50HV Self-heating

The LM50HV temperature accuracy error (due to self-heating) versus power supply is shown in Figure 8-8. The device is soldered to 30-gauge wire in this measurement and the temperature is read after consistently 10 minutes working of the device at 25°C. Since temperature error is directly proportional to thermal resistance (Rth) and power (+VS × IDD), the temperature error is increased by changing power supply from 3V to 36V. By considering junction-to-ambient thermal resistance value in Section 6.4 and supply current vs supply voltage in Figure 6-26, temperature error around ±0.15°C should be expected (for up to 36V power supply) between calculated value (ΔTERR (°C) = Rth × (+VS) × IDD) and measured value shown in Figure 8-8. This possible deviation is due to hard controlling of air temperature and humidity, position of the device on the test setup and other factors which are addressed in Analyzing PCB Thermal Resistance in High-Accuracy Temperature Sensors application note.

LM50 LM50HV Accuracy (Due to Self-heating) vs Supply Voltage
The device soldered to 30 gauge wire. The accuracy is read after consistently 10min working of the device at 25°C.
Figure 8-8 Accuracy (Due to Self-heating) vs Supply Voltage