SNIS118I July 1999 – October 2025 LM50 , LM50HV
PRODUCTION DATA
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Device Comparison
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
6.7 Typical Characteristics (LM50B and LM50C)
To generate these curves the device is mounted to a printed circuit board as shown in Figure 8-14 or Figure 8-15.
Figure 6-1 Thermal Resistance Junction-to-Ambient (Legacy chip)
Figure 6-3 Thermal Response in Still Air With Heat Sink (Legacy chip)
Figure 6-5 Thermal Response in Stirred Oil Bath With Heat Sink (0.5 inches × 0.5 inches PCB board)
Figure 6-7 Thermal Response in Still Air Without a Heat Sink (Legacy chip)
Figure 6-9 Start-Up Voltage vs Temperature (Legacy chip)
Figure 6-11 Quiescent Current vs Temperature (Legacy chip)
Figure 6-13 Accuracy vs Temperature (Legacy chip)
Figure 6-15 Noise Voltage (Legacy chip)
Figure 6-17 Supply Current vs Supply Voltage (Legacy chip)
Figure 6-19 Start-Up Response (Legacy chip)
Figure 6-2 Thermal Time Constant (Legacy chip)
Figure 6-6 Thermal Response in Stirred Oil Bath Without Heat Sink
Figure 6-8 Thermal Response in Still Air Without a Heat Sink (Both Legacy and New Chip in the New Test Setup)
Figure 6-10 Start-Up Voltage vs Temperature (New chip)
Figure 6-12 Quiescent Current vs Temperature (New chip)
Figure 6-14 Accuracy vs Temperature (New chip)
Figure 6-16 Noise Voltage (New chip)
Figure 6-18 Supply Current vs Supply Voltage (New chip)
Figure 6-20 Start-Up Response (New chip)