SNIS118I July   1999  – October 2025 LM50 , LM50HV

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: LM50 (LM50B and LM50C)
    6. 6.6 Electrical Characteristics: LM50HV
    7. 6.7 Typical Characteristics (LM50B and LM50C)
    8. 6.8 Typical Characteristics (LM50HV)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LM50 and LM50HVTransfer Function
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Full-Range Centigrade Temperature Sensor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitive Bypass and Loads
          2. 8.2.1.2.2 LM50HV Self-heating
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
      3. 8.5.3 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1.      Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

4 Device Comparison

Table 4-1 Device Comparison
Feature LM50HV LM50B(1) LM50C(1)
LMT90(1)		 TMP235 LM60(1) LM61B(1) LM20B(1) LM35(1)
Sensor gain
(mV/°C)		 10 10 10 10 6.25 10 -11.77 10
Sensor gain type Fixed Fixed Fixed Fixed Fixed Fixed Fixed Fixed
Offset at 0°C
(mV)		 500 500 500 500 424 600 1864 0
Temp Range (°C) -40 to 150 -40 to 125 -40 to 125 -40 to 150 -40 to 125 -25 to 85 -55 to 130 -55 to 150
Power Supply Specifications
VDD (V) 3 to 36 4.5 to 10 4.5 to 10 2.3 to 5.5 2.7 to 10 2.7 to 10 2.4 to 5.5 4 to 30
IQ (typ) (µA) 52 95 95 9 82 82 4.5 67
Temperature Accuracy
25°C (typ) ±1 - - ±0.5 - - - ±0.2
-55°C (max) - - - - - - ±2.5 ±1
-40°C (max) ±3.5 -3.5/3 ±4 ±2 ±3 - ±2.3 ±0.9
-30°C (max) ±3.5 -3.3/2.85 ±3.85 ±2 ±2.85 - ±2.2 ±0.85
-25°C (max) ±3.5 -3.2/2.8 ±3.8 ±2 ±2.8 ±3 ±2.1 ±0.8
-20°C (max) ±3 -3/2.7 ±3.7 ±2 ±2.7 ±2.9 ±2.05 ±0.8
-10°C (max) ±2.5 -2.8/2.5 ±3.5 ±2 ±2.5 ±2.7 ±1.95 ±0.7
0°C (max) ±2.5 -2.6/2.4 ±3.4 ±1 ±2.4 ±2.5 ±1.9 ±0.65
20°C (max) ±2 ±2.1 ±3.1 ±1 ±2.1 ±2.1 ±1.55 ±0.5
25°C (max) ±2 ±2 ±3 ±1 ±2 ±2 ±1.5 ±0.5
30°C (max) ±2 ±2.05 ±3.05 ±1 ±2.05 ±2.1 ±1.5 ±0.5
70°C (max) ±2 ±2.45 ±3.45 ±1 ±2.45 ±2.75 ±1.9 ±0.7
80°C (max) ±2.5 ±2.55 ±3.55 ±2 ±2.55 ±2.9 ±2 ±0.7
85°C (max) ±2.5 ±2.6 ±3.6 ±2 ±2.6 ±3 ±2.1 ±0.75
100°C (max) ±2.5 ±2.75 ±3.75 ±2 ±2.75 - ±2.2 ±0.8
125°C (max) ±2.5 ±3 ±4 ±2 ±3 - ±2.5 ±0.9
130°C (max) ±3 - - ±2 - - ±2.5 ±0.9
150°C (max) ±3 - - ±2 - - - ±1
Packaging Dimension
Dimensions
[mm × mm × mm]		 SOT23
(3-pin)
2.4 × 2.9 × 1.1		 SOT23
(3-pin)
2.4 × 2.9 × 1.1
SC70
(5-pin)
2.1 × 2.0 × 1.1		 SOT23
(3-pin)
2.4 × 2.9 × 1.1
TO92
(3-pin)
4.8 × 7.4 × 3.7		 SC70
(5-pin)
2.1 × 2.0 × 1.1
DSBGA
(4-pin)
0.96 × 0.96 × 0.6		 SOIC
(8-pin)
6.0 × 4.9 × 1.75
TO92
(3-pin)
4.8 × 7.4 × 3.7
TOCAN
(3-pin)
4.7 × 4.7 × 2.67
TO220
(3-pin)
10 × 15 × 4.6
  1. LM50B, LM50C, LMT90, LM60, LM61B, LM20B and LM35 temperature accuracy limits come from the "Accuracy vs Temperature" plot.
Table 4-2 LM50 and LM50HV Devices Orderable Options
DEVICE NAME PART NUMBER ACCURACY OVER TEMPERATURE SPECIFIED TEMPERATURE RANGE SUPPLY RANGE PACKAGE
LM50 LM50BIM3

-3.5°C/3°C

–25°C ≤ TA ≤ +100°C

 4.5V to 10V SOT-23
(DBZ)
3-pin
LM50BIM3X/NOPB1 –25°C ≤ TA ≤ +100°C
(Legacy chip)
–40°C ≤ TA ≤ +125°C
(New chip)
LM50CIM3 ±4°C –40°C ≤ TA ≤ +125°C
LM50CIM3X
LM50CIM3X/NOPB –40°C ≤ TA ≤ +125°C
(Both legacy & new chip)
LM50HV LM50HVDBZR ±2°C 20°C ≤ TA ≤ +70°C 3V to 36V
±2.5°C –10°C ≤ TA ≤ +125°C
±3.5°C –40°C ≤ TA ≤ +125°C
±3°C –20°C ≤ TA ≤ +150°C
±3.5°C –40°C ≤ TA ≤ +150°C
  1. LM50BIM3X/NOPB (Legacy chip) operates from –25°C to 100°C while LM50BIM3X/NOPB (New chip) operates from –40°C to 125°C.
Table 4-3 LM50 and LM50HV Devices Nomenclature Detail
PRODUCT DESCRIPTION
LM50xIyyy x indicates that the device has B or C variant. These devices can ship with the legacy chip (CSO: GF6 or SHE) or the new chip (CSO: RFB) with different chip source origin (CSO). The reel packaging label provides date code information to distinguish which chip is being used. Device performance for new and legacy chips is denoted throughout the document.
yyy indicates the package type of the device which can be M3, M3X and M3X/NOPB all in DBZ (SOT-23 3-pin).
LM50HVyyyR LM50HV has only CSO: RFB.
yyy indicates that the package type of the device is DBZ (SOT-23 3-pin).