(1)| ESD Tolerance (2) | 2kV |
| Differential Input Voltage | (VCC) +0.3V to (−VCC)−0.3V |
| Voltage at Input/Output Pin | (VCC) + 0.3V to (−VCC)−0.3V |
| Supply Voltage (V+–V−) | 16V |
| Current at Input Pin (3) | ±5mA |
| Current at Output Pin(4) (5) | ±30mA |
| Current at Power Supply Pin | 40mA |
| Lead Temperature | (soldering, 10 sec) | 260°C |
| Storage Temperature Range | −65°C to +150°C |
| Junction Temperature(6) | 150°C |
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device can
occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but
specific performance is not specified. For
specified specifications and the test conditions,
see the Electrical Characteristics.
(2) Human body model, 1.5kΩ in series with 100pF.
(3) Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage rating.
(4) Applies to both single-supply and split-supply operation. Continuous short
circuit operation at elevated ambient temperature
can result in exceeding the maximum allowed
junction temperature of 150°C. Output currents in
excess of ±30mA over long term can adversely
affect reliability.
(5) Do not short circuit output to V+, when V+ is greater than 1V or reliability is
adversely affected.
(6) The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max) − TA)/θJA.All numbers apply for packages soldered directly into a PC board.