SNOSDL7A January   2025  – December 2025 LMG3650R070

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Switching Parameters
      1. 6.1.1 Turn-On Times
      2. 6.1.2 Turn-Off Times
      3. 6.1.3 Drain-Source Turn-On and Turn-off Slew Rate
      4. 6.1.4 Zero-Voltage Detection Times (LMG3656R070 only)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 LMG3650R070 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Drive Strength Adjustment
      2. 7.3.2 VDD Supply
      3. 7.3.3 Overcurrent and Short-Circuit Protection
      4. 7.3.4 Overtemperature Protection
      5. 7.3.5 UVLO Protection
      6. 7.3.6 Fault Reporting
      7. 7.3.7 Auxiliary LDO (LMG3651R070 Only)
      8. 7.3.8 Zero-Voltage Detection (ZVD) (LMG3656R070 Only)
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Slew Rate Selection
        2. 8.2.1.2 Signal Level-Shifting
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Using an Isolated Power Supply
      2. 8.3.2 Using a Bootstrap Diode
        1. 8.3.2.1 Diode Selection
        2. 8.3.2.2 Managing the Bootstrap Voltage
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Solder-Joint Reliability
        2. 8.4.1.2 Power-Loop Inductance
        3. 8.4.1.3 Signal-Ground Connection
        4. 8.4.1.4 Bypass Capacitors
        5. 8.4.1.5 Switch-Node Capacitance
        6. 8.4.1.6 Signal Integrity
        7. 8.4.1.7 High-Voltage Spacing
        8. 8.4.1.8 Thermal Recommendations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1.     PACKAGE OPTION ADDENDUM
    2. 11.1 Tape and Reel Information
    3. 11.2 Mechanical, Packaging, and Orderable Information

8.4.1 Layout Guidelines

The layout of the LMG365xR070 is critical to device performance and functionality. Because the half-bridge configuration is typically used with GaN devices, layout recommendations are considered with this configuration. A four-layer or higher layer count board is recommended to reduce the parasitic inductances of the layout. The following figures summarize critical layout guidelines, and more details are further elaborated in the following sections.

LMG3650R070 LMG3651R070 LMG3656R070 LMG3657R070 LMG3650R070 Typical Schematic With Layout Considerations Figure 8-9 LMG3650R070 Typical Schematic With Layout Considerations
LMG3650R070 LMG3651R070 LMG3656R070 LMG3657R070 LMG3651R070 Typical Schematic With Layout Considerations Figure 8-10 LMG3651R070 Typical Schematic With Layout Considerations
LMG3650R070 LMG3651R070 LMG3656R070 LMG3657R070 LMG3656R070 or LMG3657R070 Typical Schematic With Layout Considerations Figure 8-11 LMG3656R070 or LMG3657R070 Typical Schematic With Layout Considerations