SNOSDL7A January   2025  – December 2025 LMG3650R070

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 Switching Parameters
      1. 6.1.1 Turn-On Times
      2. 6.1.2 Turn-Off Times
      3. 6.1.3 Drain-Source Turn-On and Turn-off Slew Rate
      4. 6.1.4 Zero-Voltage Detection Times (LMG3656R070 only)
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 LMG3650R070 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Drive Strength Adjustment
      2. 7.3.2 VDD Supply
      3. 7.3.3 Overcurrent and Short-Circuit Protection
      4. 7.3.4 Overtemperature Protection
      5. 7.3.5 UVLO Protection
      6. 7.3.6 Fault Reporting
      7. 7.3.7 Auxiliary LDO (LMG3651R070 Only)
      8. 7.3.8 Zero-Voltage Detection (ZVD) (LMG3656R070 Only)
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Slew Rate Selection
        2. 8.2.1.2 Signal Level-Shifting
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Using an Isolated Power Supply
      2. 8.3.2 Using a Bootstrap Diode
        1. 8.3.2.1 Diode Selection
        2. 8.3.2.2 Managing the Bootstrap Voltage
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Solder-Joint Reliability
        2. 8.4.1.2 Power-Loop Inductance
        3. 8.4.1.3 Signal-Ground Connection
        4. 8.4.1.4 Bypass Capacitors
        5. 8.4.1.5 Switch-Node Capacitance
        6. 8.4.1.6 Signal Integrity
        7. 8.4.1.7 High-Voltage Spacing
        8. 8.4.1.8 Thermal Recommendations
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1.     PACKAGE OPTION ADDENDUM
    2. 11.1 Tape and Reel Information
    3. 11.2 Mechanical, Packaging, and Orderable Information

Signal Level-Shifting

In half-bridges, use high-voltage level shifters or digital isolators to provide isolation for signal paths between the high-side device and control circuit. Using an isolator is optional for the low-side device. However, using and isolator equalizes the propagation delays between the high-side and low-side signal paths, and provides the ability to use different grounds for the GaN device and the controller. If an isolator is not used on the low-side device, connect the control ground and power ground at the device and nowhere else on the board. For more information, see Layout Guidelines. With fast-switching devices, common ground inductance can easily cause noise issues without the use of an isolator.

Choosing a digital isolator for level-shifting is important for improvement of noise immunity. As GaN device can easily create high dv/dt, > 50V/ns, TI highly recommends using isolators with high common-mode transient immunity (CMTI) and low barrier capacitance. Isolators with low CMTI can easily generate false signals, which can cause shoot-through. The barrier capacitance is part of the isolation capacitance between the signal ground and power ground, which is directionally proportional to the common mode current and EMI emission generated during the switching. Additionally, TI strongly encourages selecting non-edge-triggered isolators. In an edge-triggered isolator, a high dv/dt event can cause the isolator to flip states and cause circuit malfunction.

Generally, the preference is ON/OFF keyed isolators with a low default output. Default low state establishes that the system does not shoot-through when starting up or recovering from fault events. A high CMTI event causes a very short (a few nanoseconds) false pulse, TI recommends placing a low pass filter (such as 50Ω and 150pF R-C) at the driver input to filter out the false pulses.